Research Output 1978 2019

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Review article
2018
12 Citations (Scopus)

Integrated circuit packaging review with an emphasis on 3D packaging

Lancaster, A. & Keswani, M. K., Jan 1 2018, In : Integration, the VLSI Journal. 60, p. 204-212 9 p.

Research output: Contribution to journalReview article

Integrated circuits
Packaging
Mechanical stability
Environmental protection
Temperature control
2016
1 Citation (Scopus)

Review-understanding and controlling electrochemical effects in wet processing

Raghavan, S. & Chiang, C. C., 2016, In : ECS Journal of Solid State Science and Technology. 5, 6, p. P309-P314

Research output: Contribution to journalReview article

Processing
Passivation
Integrated circuits
Etching
Cleaning