Fingerprint Fingerprint is based on mining the text of the person's scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

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Impurities Engineering & Materials Science
Water Engineering & Materials Science
Temperature Engineering & Materials Science
Adsorption Engineering & Materials Science
Semiconductor materials Engineering & Materials Science
Moisture Engineering & Materials Science
Kinetics Engineering & Materials Science
Carbon Engineering & Materials Science

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Research Output 1977 2017

  • 1481 Citations
  • 19 h-Index
  • 87 Article
  • 32 Conference contribution
  • 2 Chapter
2 Citations
Semiconductors
Biological Assay
Toxicity
Semiconductor materials
III-V semiconductors

Rinsing of high-aspect-ratio features on patterned wafers

Chiang, C. C., Kishore, J., Raghavan, S. & Shadman, F. Feb 1 2017 In : IEEE Transactions on Semiconductor Manufacturing. 30, 1, p. 60-68 9 p., 7586061

Research output: Research - peer-reviewArticle

high aspect ratio
wafers
Aspect ratio
surface reactions
cleaning
Silica
Filtration
Porous Media
Nanoparticles
Carbon

Application of process simulation for comparison of contactless and conventional electrodeposition methods for 3D packaging

Zhao, M., Jakes, K., Luke, K., Kishore, J., Gouk, R., Verhaverbeke, S., Shadman, F. & Keswani, M. 2016 In : ECS Journal of Solid State Science and Technology. 5, 9, p. P483-P488

Research output: Research - peer-reviewArticle

Electrodeposition
Packaging
Copper
Silicon
Deposition rates
2 Citations

Contactless bottom-up electrodeposition of nickel for 3D integrated circuits

Zhao, M., Balachandran, R., Patterson, Z., Gouk, R., Verhaverbeke, S., Shadman, F. & Keswani, M. 2015 In : RSC Advances. 5, 56, p. 45291-45299 9 p.

Research output: Research - peer-reviewArticle

Nickel
Electrodeposition
Three dimensional integrated circuits
Silicon
Deposition rates