• 350 Citations
  • 11 h-Index
20062019
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Fingerprint Dive into the research topics where Manish K Keswani is active. These topic labels come from the works of this person. Together they form a unique fingerprint.

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Cleaning Engineering & Materials Science
Cavitation Engineering & Materials Science
cavitation flow Physics & Astronomy
cleaning Physics & Astronomy
Sonoluminescence Engineering & Materials Science
Acoustics Engineering & Materials Science
wafers Physics & Astronomy
Copper Chemical Compounds

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Research Output 2006 2019

  • 350 Citations
  • 11 h-Index
  • 46 Article
  • 16 Conference contribution
  • 3 Chapter
  • 1 Review article

Adhesion enhancement of polymer surfaces by Ion beam treatment: A critical review

Srinadhu, E. S., Shyam, R., Kumar, J., Thanu, D. P. R., Zhao, M. & Keswani, M., Jan 1 2019, In : Reviews of Adhesion and Adhesives. 7, 2, p. 169-194 26 p.

Research output: Contribution to journalArticle

Ion beams
Polymers
Adhesion
Ions
Microelectronics
1 Citation (Scopus)

Adhesion phenomena pertaining to thermal interface materials and solder interconnects in microelectronic packaging: A critical review

Thanu, D. P. R., Antoniswamy, A., Danaei, R. & Keswani, M. K., Mar 1 2018, In : Reviews of Adhesion and Adhesives. 6, 1, p. 1-25 25 p.

Research output: Contribution to journalArticle

Spreaders
Microelectronics
Soldering alloys
Packaging
Adhesion

Gradient filling of copper in porous silicon using a non-contact electrochemical method

Zhao, M., Shadman, F. & Keswani, M. K., Jul 1 2018, In : Applied Surface Science. 445, p. 505-511 7 p.

Research output: Contribution to journalArticle

Porous silicon
Copper
Copper Sulfate
Etching
Current density
12 Citations (Scopus)

Integrated circuit packaging review with an emphasis on 3D packaging

Lancaster, A. & Keswani, M. K., Jan 1 2018, In : Integration, the VLSI Journal. 60, p. 204-212 9 p.

Research output: Contribution to journalReview article

Integrated circuits
Packaging
Mechanical stability
Environmental protection
Temperature control
3 Citations (Scopus)
Alkanesulfonates
Transducers
Acoustics
foams
Foams