• 294 Citations
  • 9 h-Index
20062018
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Research Output 2006 2018

  • 294 Citations
  • 9 h-Index
  • 45 Article
  • 16 Conference contribution
  • 3 Chapter
  • 1 Review article

Adhesion phenomena pertaining to thermal interface materials and solder interconnects in microelectronic packaging: A critical review

Thanu, D. P. R., Antoniswamy, A., Danaei, R. & Keswani, M., Mar 1 2018, In : Reviews of Adhesion and Adhesives. 6, 1, p. 1-25 25 p.

Research output: Contribution to journalArticle

Spreaders
Microelectronics
Soldering alloys
Packaging
Adhesion

Gradient filling of copper in porous silicon using a non-contact electrochemical method

Zhao, M., Shadman, F. & Keswani, M. Jul 1 2018 In : Applied Surface Science. 445, p. 505-511 7 p.

Research output: Contribution to journalArticle

Porous silicon
Copper
Copper Sulfate
Etching
Current density
1 Citations

Integrated circuit packaging review with an emphasis on 3D packaging

Lancaster, A. & Keswani, M., Jan 1 2018, In : Integration, the VLSI Journal. 60, p. 204-212 9 p.

Research output: Contribution to journalReview article

Integrated circuits
Packaging
Mechanical stability
Environmental protection
Temperature control
Alkanesulfonates
Spreaders
Transducers
Acoustics
foams
2 Citations

Treatment of perfluorooctane sulfonic acid (PFOS) using a large-scale sonochemical reactor

Gole, V. L., Fishgold, A., Sierra-Alvarez, R., Deymier, P. & Keswani, M., Apr 3 2018, In : Separation and Purification Technology. 194, p. 104-110 7 p.

Research output: Contribution to journalArticle

Fluorides
Acids
Sulfates
Ions
Fluorination