• 294 Citations
  • 9 h-Index
20062018
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Research Output 2006 2018

  • 294 Citations
  • 9 h-Index
  • 45 Article
  • 16 Conference contribution
  • 3 Chapter
  • 1 Review article
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Review article
2018
1 Citations

Integrated circuit packaging review with an emphasis on 3D packaging

Lancaster, A. & Keswani, M., Jan 1 2018, In : Integration, the VLSI Journal. 60, p. 204-212 9 p.

Research output: Contribution to journalReview article

Integrated circuits
Packaging
Mechanical stability
Environmental protection
Temperature control