Research Output 2006 2018

  • 230 Citations
  • 8 h-Index
  • 39 Article
  • 16 Conference contribution
  • 3 Chapter
  • 1 Review article
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Review article
2018

Integrated circuit packaging review with an emphasis on 3D packaging

Lancaster, A. & Keswani, M. Jan 1 2018 In : Integration, the VLSI Journal. 60, p. 204-212 9 p.

Research output: Research - peer-reviewReview article

Integrated circuits
Packaging
Mechanical stability
Environmental protection
Temperature control