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Fingerprint Fingerprint is based on mining the text of the experts' scientific documents to create an index of weighted terms, which defines the key subjects of each individual researcher.

Thermal conductivity Engineering & Materials Science
thermal conductivity Physics & Astronomy
Nanobelts Engineering & Materials Science
figure of merit Physics & Astronomy
mean free path Physics & Astronomy
Heat transfer Engineering & Materials Science
Phonon scattering Engineering & Materials Science
Eutectics Engineering & Materials Science

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Research Output 2002 2018

  • 4215 Citations
  • 15 h-Index
  • 40 Article
  • 16 Conference contribution
  • 1 Conference article

Electrothermal studies of GaN-based high electron mobility transistors with improved thermal designs

Hao, Q., Zhao, H., Xiao, Y. & Kronenfeld, M. B., Jan 1 2018, In : International Journal of Heat and Mass Transfer. 116, p. 496-506 11 p.

Research output: Contribution to journalArticle

High electron mobility transistors
high electron mobility transistors
Temperature control
Fourier law
Solar energy
Molten materials
Heat transfer

Hybrid Electrothermal Simulation of a 3-D Fin-Shaped Field-Effect Transistor Based on GaN Nanowires

Hao, Q., Zhao, H., Xiao, Y., Wang, Q. & Wang, X., Mar 1 2018, In : IEEE Transactions on Electron Devices. 65, 3, p. 921-927 7 p.

Research output: Contribution to journalArticle

Gallium nitride
Field effect transistors
1 Citations

Largely reduced cross-plane thermal conductivity of nanoporous In0.1Ga0.9N thin films directly grown by metal organic chemical vapor deposition

Xu, D., Wang, Q., Wu, X., Zhu, J., Zhao, H., Xiao, B., Wang, X., Wang, X. & Hao, Q., Jan 5 2018, (Accepted/In press) In : Frontiers in Energy. p. 1-10 10 p.

Research output: Contribution to journalArticle

Organic chemicals
Chemical vapor deposition
Thermal conductivity
Thin films

Nanograined GeSe4 as a thermal insulation material

Hao, Q., Coleman, G. J., Xu, D., Segal, E. R., Agee, P., Wu, S. & Lucas, P., Apr 11 2018, In : Frontiers in Energy Research. 6, APR, 21

Research output: Contribution to journalArticle

Thermal insulation
Strength of materials
Thermal conductivity
Chemical analysis