1-D FDTD EM, thermal, and displacement multiphysics simulations

Zach S. Eyde, Richard W Ziolkowski

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

1-D FDTD solvers are being developed to simulate multiphysics problems seen in real world applications. These simulators are attempting to solve self-consistently the Maxwell, heat conduction and thermoelasticity equations in the time domain and determine the impact of thermal variations on electromagnetic performance, e.g., the reflection and transmission coefficients of a periodic structure. The solvers are being used to study two main situations: 1) EM emission control by thermally heating a periodic structure and the change in this emission control when changes in material properties and physical dimensions of the structure occur. 2) EM performance degradation caused by the heating from the material losses and the associated dimensional changes in the periodic structure. The results from this study lay the basis for advancing to 2-D and 3-D solvers that can be used to study antennas in extreme environments like missile flights and space environments.

Original languageEnglish (US)
Title of host publicationIEEE Antennas and Propagation Society, AP-S International Symposium (Digest)
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1399-1400
Number of pages2
ISBN (Print)9781479935406
DOIs
Publication statusPublished - Sep 18 2014
Event2014 IEEE Antennas and Propagation Society International Symposium, APSURSI 2014 - Memphis, United States
Duration: Jul 6 2014Jul 11 2014

Other

Other2014 IEEE Antennas and Propagation Society International Symposium, APSURSI 2014
CountryUnited States
CityMemphis
Period7/6/147/11/14

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Eyde, Z. S., & Ziolkowski, R. W. (2014). 1-D FDTD EM, thermal, and displacement multiphysics simulations. In IEEE Antennas and Propagation Society, AP-S International Symposium (Digest) (pp. 1399-1400). [6905025] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/APS.2014.6905025