3D optical interconnects for high-speed interchip and interboard communications

Ahmed Louri, Ahmed Louri

Research output: Contribution to journalArticle

14 Citations (Scopus)

Abstract

Increasing volumes of data handled by today's information systems, coupled with the growing need for more processing functionality and system throughput, are placing stringent demands on communication bandwidths and processing speeds. Metal-based communications between subsystems and chips has become the limiting factor in high-speed computing. Maturing optics-based technologies offer advantages that may unplug this bottleneck. Optical interconnects offer high-speedcomputers key advantages over metal interconnects. These include: high spatial and temporal bandwidths; high-speed transmission; low crosstalk independent of data rates; and high interconnect densities.

Original languageEnglish (US)
Pages (from-to)27-37
Number of pages11
JournalComputer
Volume27
Issue number10
DOIs
StatePublished - Oct 1994

Fingerprint

Optical interconnects
Communication
Bandwidth
Crosstalk
Processing
Metals
Optics
Information systems
Throughput

ASJC Scopus subject areas

  • Computer Graphics and Computer-Aided Design
  • Hardware and Architecture
  • Software

Cite this

3D optical interconnects for high-speed interchip and interboard communications. / Louri, Ahmed; Louri, Ahmed.

In: Computer, Vol. 27, No. 10, 10.1994, p. 27-37.

Research output: Contribution to journalArticle

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