3D printable multilayer RF integrated system

Xiaoju Yu, Min Liang, Corey Shemelya, Ryan Wicker, Eric MacDonald, Hao Xin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and highdirective scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).

Original languageEnglish (US)
Title of host publicationProceedings of the International Telemetering Conference
PublisherInternational Foundation for Telemetering
Pages928-933
Number of pages6
Volume82
StatePublished - 2015

Keywords

  • 3D print
  • Multi-layer
  • Phased array
  • Vertical interconnection

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Computer Networks and Communications
  • Signal Processing

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  • Cite this

    Yu, X., Liang, M., Shemelya, C., Wicker, R., MacDonald, E., & Xin, H. (2015). 3D printable multilayer RF integrated system. In Proceedings of the International Telemetering Conference (Vol. 82, pp. 928-933). International Foundation for Telemetering.