3D printable multilayer RF integrated system

Xiaoju Yu, Min Liang, Corey Shemelya, Ryan Wicker, Eric MacDonald, Hao Xin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and highdirective scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).

Original languageEnglish (US)
Title of host publicationProceedings of the International Telemetering Conference
PublisherInternational Foundation for Telemetering
Pages928-933
Number of pages6
Volume82
StatePublished - 2015

Fingerprint

phased arrays
Multilayers
3D printers
wire cloth
Antenna phased arrays
impedance matching
Phase shifters
embedding
laminates
switches
antennas
manufacturing
conductors
amplifiers
Ultrasonics
Switches
Wire
Antennas
Scanning
scanning

Keywords

  • 3D print
  • Multi-layer
  • Phased array
  • Vertical interconnection

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation
  • Computer Networks and Communications
  • Signal Processing

Cite this

Yu, X., Liang, M., Shemelya, C., Wicker, R., MacDonald, E., & Xin, H. (2015). 3D printable multilayer RF integrated system. In Proceedings of the International Telemetering Conference (Vol. 82, pp. 928-933). International Foundation for Telemetering.

3D printable multilayer RF integrated system. / Yu, Xiaoju; Liang, Min; Shemelya, Corey; Wicker, Ryan; MacDonald, Eric; Xin, Hao.

Proceedings of the International Telemetering Conference. Vol. 82 International Foundation for Telemetering, 2015. p. 928-933.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Yu, X, Liang, M, Shemelya, C, Wicker, R, MacDonald, E & Xin, H 2015, 3D printable multilayer RF integrated system. in Proceedings of the International Telemetering Conference. vol. 82, International Foundation for Telemetering, pp. 928-933.
Yu X, Liang M, Shemelya C, Wicker R, MacDonald E, Xin H. 3D printable multilayer RF integrated system. In Proceedings of the International Telemetering Conference. Vol. 82. International Foundation for Telemetering. 2015. p. 928-933
Yu, Xiaoju ; Liang, Min ; Shemelya, Corey ; Wicker, Ryan ; MacDonald, Eric ; Xin, Hao. / 3D printable multilayer RF integrated system. Proceedings of the International Telemetering Conference. Vol. 82 International Foundation for Telemetering, 2015. pp. 928-933
@inproceedings{645b5ade23f54dffae951c412b2e71ea,
title = "3D printable multilayer RF integrated system",
abstract = "In this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and highdirective scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).",
keywords = "3D print, Multi-layer, Phased array, Vertical interconnection",
author = "Xiaoju Yu and Min Liang and Corey Shemelya and Ryan Wicker and Eric MacDonald and Hao Xin",
year = "2015",
language = "English (US)",
volume = "82",
pages = "928--933",
booktitle = "Proceedings of the International Telemetering Conference",
publisher = "International Foundation for Telemetering",

}

TY - GEN

T1 - 3D printable multilayer RF integrated system

AU - Yu, Xiaoju

AU - Liang, Min

AU - Shemelya, Corey

AU - Wicker, Ryan

AU - MacDonald, Eric

AU - Xin, Hao

PY - 2015

Y1 - 2015

N2 - In this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and highdirective scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).

AB - In this work, a 3D-printable multilayer phased array system is designed to demonstrate the applicability of additive manufacturing technique combining dielectric and conductor processes at room temperature for RF systems. Phased array systems normally include feeding networks, antennas, and active components such as switches, phase shifters and amplifiers. To make the integrated system compact, the array system here uses multilayer structure that can fully utilize the 3D space. The vertical interconnections between layers are carefully designed to reduce the loss between layers. Simulated results show good impedance matching and highdirective scanning beam. This multilayer phased array will finally be 3D printed by integrating thermal / ultrasound wire mesh embedding method (for metal) and fused-deposition-modeling technique (for dielectric).

KW - 3D print

KW - Multi-layer

KW - Phased array

KW - Vertical interconnection

UR - http://www.scopus.com/inward/record.url?scp=84958536329&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84958536329&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84958536329

VL - 82

SP - 928

EP - 933

BT - Proceedings of the International Telemetering Conference

PB - International Foundation for Telemetering

ER -