3D printed multilayer microstrip line structure with vertical transition toward integrated systems

Min Liang, Xiaoju Yu, Corey Shemelya, Eric Macdonald, Hao Xin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

16 Scopus citations

Abstract

In this paper, a 3D printed multilayer microstrip line structure with vertical transition is designed, fabricated and characterized. The dielectric part of the structure is printed using the FDM method and the conductor part is printed using the ultrasonic wire embedding approach. The measured total insertion loss of the 3D printed multilayer microstrip (90 mm long) including the vertical transition is smaller than 2 dB below 6 GHz. The measured results agree well with the simulation. The performance of this structure demonstrates that 3D printing techniques may be able to realize functional multilayer RF components / systems. As an example, a 3D printed multilayer phased array is designed based on similiar microstrip and vertical transition structure in this work. The simulated results show good impedance matching around 3.5GHz and a high directive beam at expected direction.

Original languageEnglish (US)
Title of host publication2015 IEEE MTT-S International Microwave Symposium, IMS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Print)9781479982752
DOIs
StatePublished - Jul 24 2015
EventIEEE MTT-S International Microwave Symposium, IMS 2015 - Phoenix, United States
Duration: May 17 2015May 22 2015

Other

OtherIEEE MTT-S International Microwave Symposium, IMS 2015
Country/TerritoryUnited States
CityPhoenix
Period5/17/155/22/15

Keywords

  • 3D printing
  • Additive manufacturing
  • multilayer microstrip line
  • vertical transition

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Signal Processing
  • Electrical and Electronic Engineering

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