3D via modeling simplification on multilayer mid-planes

Qian Li, Kathleen L. Melde, Gong Jong Yeh, Hui Wu, Yaochao Yang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

This paper presents a method to simplify the 3D full-wave simulation of via structures on the multilayer mid-planes. The method splits the full-length via model into small via sections, simulates these sections separately. The final simulation results are obtained by cascading the scattering parameters for the small via sections. The simulation accuracy of the cascaded structure for FEXT is comparable to the accuracy obtained with simulations of the 3D via using full-wave simulations in HFSS for frequencies up to 20GHz for both uniform structures and the structures with discontinuity. The results show a dramatic reduction in simulation time and complexity.

Original languageEnglish (US)
Title of host publication2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
Pages207-210
Number of pages4
DOIs
StatePublished - Dec 1 2011
Event2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 - San Jose, CA, United States
Duration: Oct 23 2011Oct 26 2011

Publication series

Name2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011

Other

Other2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011
CountryUnited States
CitySan Jose, CA
Period10/23/1110/26/11

Keywords

  • Cascade Method
  • Signal Integrity
  • Simplification
  • Via Modeling

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Li, Q., Melde, K. L., Yeh, G. J., Wu, H., & Yang, Y. (2011). 3D via modeling simplification on multilayer mid-planes. In 2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011 (pp. 207-210). [6100228] (2011 IEEE 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS-2011). https://doi.org/10.1109/EPEPS.2011.6100228