A broadband CPW-to-microstrip via-less transition for on wafer package probing applications

Lin Zhu, Kathleen L. Melde, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

A broadband CPW to microstrip via-less transition is proposed and the optimal design is discussed. Simulation and measurement results are given. The results of the transition as multiline TRL calibration standards are presented.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages75-78
Number of pages4
ISBN (Electronic)0780381289, 9780780381285
DOIs
StatePublished - Jan 1 2003
EventElectrical Performance of Electronic Packaging, 2003 - Princeton, United States
Duration: Oct 27 2003Oct 29 2003

Publication series

NameElectrical Performance of Electronic Packaging

Other

OtherElectrical Performance of Electronic Packaging, 2003
CountryUnited States
CityPrinceton
Period10/27/0310/29/03

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Hardware and Architecture

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    Zhu, L., Melde, K. L., & Prince, J. L. (2003). A broadband CPW-to-microstrip via-less transition for on wafer package probing applications. In Electrical Performance of Electronic Packaging (pp. 75-78). [1250003] (Electrical Performance of Electronic Packaging). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.2003.1250003