TY - JOUR
T1 - A mini review on thermally conductive polymers and polymer-based composites
AU - Xu, Yanfei
AU - Wang, Xiaojia
AU - Hao, Qing
N1 - Funding Information:
Hao and Wang thank the support from National Science Foundation (grant number CBET-1803931 ). Yanfei Xu thanks the Faculty Startup Fund Support from University of Massachusetts Amherst .
PY - 2021/4
Y1 - 2021/4
N2 - The continuous trend of miniaturization leads to unprecedented power densities within electronic devices, which also becomes the bottleneck of the device performance. Effective cooling of electronic devices is critical and polymer-based materials may play an important role in this important direction, with advantages such as low cost, corrosion resistance, light weight, and flexibility. For thermal management applications, the intrinsically low thermal conductivities of amorphous polymers can be dramatically enhanced with strain-induced crystallization and ultra-high-conductivity fillers. In this mini review, some advancements in this field are summarized and discussed, followed by a prospective on future directions.
AB - The continuous trend of miniaturization leads to unprecedented power densities within electronic devices, which also becomes the bottleneck of the device performance. Effective cooling of electronic devices is critical and polymer-based materials may play an important role in this important direction, with advantages such as low cost, corrosion resistance, light weight, and flexibility. For thermal management applications, the intrinsically low thermal conductivities of amorphous polymers can be dramatically enhanced with strain-induced crystallization and ultra-high-conductivity fillers. In this mini review, some advancements in this field are summarized and discussed, followed by a prospective on future directions.
KW - Filler
KW - Polymer
KW - Strain
KW - Thermal conductivity
UR - http://www.scopus.com/inward/record.url?scp=85099476644&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85099476644&partnerID=8YFLogxK
U2 - 10.1016/j.coco.2020.100617
DO - 10.1016/j.coco.2020.100617
M3 - Short survey
AN - SCOPUS:85099476644
VL - 24
JO - Composites Communications
JF - Composites Communications
SN - 2452-2139
M1 - 100617
ER -