A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati, Janet Wang

Research output: Contribution to journalConference article

5 Scopus citations

Abstract

As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

Original languageEnglish (US)
Pages (from-to)V-269-V-272
JournalProceedings - IEEE International Symposium on Circuits and Systems
Volume5
StatePublished - Sep 6 2004
Event2004 IEEE International Symposium on Circuits and Systems - Proceedings - Vancouver, BC, Canada
Duration: May 23 2004May 26 2004

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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