As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.
|Original language||English (US)|
|Journal||Proceedings - IEEE International Symposium on Circuits and Systems|
|State||Published - Sep 6 2004|
|Event||2004 IEEE International Symposium on Circuits and Systems - Proceedings - Vancouver, BC, Canada|
Duration: May 23 2004 → May 26 2004
ASJC Scopus subject areas
- Electrical and Electronic Engineering