A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati, Meiling Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE International Symposium on Circuits and Systems
Volume5
StatePublished - 2004
Event2004 IEEE International Symposium on Circuits and Systems - Proceedings - Vancouver, BC, Canada
Duration: May 23 2004May 26 2004

Other

Other2004 IEEE International Symposium on Circuits and Systems - Proceedings
CountryCanada
CityVancouver, BC
Period5/23/045/26/04

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Inductance

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Vakati, L. K., & Wang, M. (2004). A new multi-ramp driver model with RLC interconnect load. In Proceedings - IEEE International Symposium on Circuits and Systems (Vol. 5)

A new multi-ramp driver model with RLC interconnect load. / Vakati, Lakshmi K.; Wang, Meiling.

Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 5 2004.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Vakati, LK & Wang, M 2004, A new multi-ramp driver model with RLC interconnect load. in Proceedings - IEEE International Symposium on Circuits and Systems. vol. 5, 2004 IEEE International Symposium on Circuits and Systems - Proceedings, Vancouver, BC, Canada, 5/23/04.
Vakati LK, Wang M. A new multi-ramp driver model with RLC interconnect load. In Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 5. 2004
Vakati, Lakshmi K. ; Wang, Meiling. / A new multi-ramp driver model with RLC interconnect load. Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 5 2004.
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