Abstract
As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.
| Original language | English (US) |
|---|---|
| Pages | 170-175 |
| Number of pages | 6 |
| DOIs | |
| State | Published - 2004 |
| Event | Proceedings of the International Symposium on Physical Design, ISPD 2004 - Phoenix, AZ, United States Duration: Apr 18 2004 → Apr 21 2004 |
Other
| Other | Proceedings of the International Symposium on Physical Design, ISPD 2004 |
|---|---|
| Country | United States |
| City | Phoenix, AZ |
| Period | 4/18/04 → 4/21/04 |
Keywords
- Effective Capacitance
- Inductance Criteria
- Interconnect Modeling
- Multi-Ramp Driver Model
- Transmission line effects
ASJC Scopus subject areas
- Electrical and Electronic Engineering
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Cite this
Vakati, L. K., & Wang, J. (2004). A new multi-ramp driver model with RLC interconnect load. 170-175. Paper presented at Proceedings of the International Symposium on Physical Design, ISPD 2004, Phoenix, AZ, United States. https://doi.org/10.1145/981066.981103