A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati; Janet Wang

doi:10.1145/981066.981103

A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati, Janet Wang

Electrical and Computer Engineering

Research output: Contribution to conference › Paper › peer-review

3 Scopus citations

Abstract

As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

Original language	English (US)
Pages	170-175
Number of pages	6
DOIs	https://doi.org/10.1145/981066.981103
State	Published - 2004
Event	Proceedings of the International Symposium on Physical Design, ISPD 2004 - Phoenix, AZ, United States Duration: Apr 18 2004 → Apr 21 2004

Other

Other	Proceedings of the International Symposium on Physical Design, ISPD 2004
Country	United States
City	Phoenix, AZ
Period	4/18/04 → 4/21/04

Keywords

Effective Capacitance
Inductance Criteria
Interconnect Modeling
Multi-Ramp Driver Model
Transmission line effects

ASJC Scopus subject areas

Electrical and Electronic Engineering

Access to Document

10.1145/981066.981103

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Cite this

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abstract = "As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.",

keywords = "Effective Capacitance, Inductance Criteria, Interconnect Modeling, Multi-Ramp Driver Model, Transmission line effects",

author = "Vakati, {Lakshmi K.} and Janet Wang",

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note = "Proceedings of the International Symposium on Physical Design, ISPD 2004 ; Conference date: 18-04-2004 Through 21-04-2004",

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AB - As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

KW - Effective Capacitance

KW - Inductance Criteria

KW - Interconnect Modeling

KW - Multi-Ramp Driver Model

KW - Transmission line effects

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