A new multi-ramp driver model with RLC interconnect load

Lakshmi K. Vakati, Janet Wang

Research output: Contribution to conferencePaper

3 Scopus citations

Abstract

As the feature size is scaled down to 90 nm and below, fundamental modeling changes, such as the nonlinearity and higher frequencies of signals, require driver-load models to take into account propagation delay and slew rates. The conventional single Ceff (one-ramp) with lumped RC model is no longer accurate. In this paper we propose a new multi-ramp model with general RLC interconnects as loads. This new model accurately predicts both the 50% delay and the overall output waveform shape with inductance effects.

Original languageEnglish (US)
Pages170-175
Number of pages6
DOIs
StatePublished - 2004
EventProceedings of the International Symposium on Physical Design, ISPD 2004 - Phoenix, AZ, United States
Duration: Apr 18 2004Apr 21 2004

Other

OtherProceedings of the International Symposium on Physical Design, ISPD 2004
CountryUnited States
CityPhoenix, AZ
Period4/18/044/21/04

Keywords

  • Effective Capacitance
  • Inductance Criteria
  • Interconnect Modeling
  • Multi-Ramp Driver Model
  • Transmission line effects

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Vakati, L. K., & Wang, J. (2004). A new multi-ramp driver model with RLC interconnect load. 170-175. Paper presented at Proceedings of the International Symposium on Physical Design, ISPD 2004, Phoenix, AZ, United States. https://doi.org/10.1145/981066.981103