A new thermomechanical fracture analysis approach for 3D integration technology

Abigail Agwai, Ibrahim Guven, Erdogan Madenci

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

In this study, the peridynamic framework is applied to model heat diffusion to derive peridynamic heat diffusion equations. A numerical scheme is put forward and implemented in order to establish the validity of these equations. Finally, an approach is developed for coupled solution of heat conduction and solid mechanics equations in the realm of peridynamics.

Original languageEnglish (US)
Title of host publication2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011
Pages740-745
Number of pages6
DOIs
StatePublished - Jul 21 2011
Event2011 61st Electronic Components and Technology Conference, ECTC 2011 - Lake Buena Vista, FL, United States
Duration: May 31 2011Jun 3 2011

Publication series

NameProceedings - Electronic Components and Technology Conference
ISSN (Print)0569-5503

Other

Other2011 61st Electronic Components and Technology Conference, ECTC 2011
CountryUnited States
CityLake Buena Vista, FL
Period5/31/116/3/11

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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  • Cite this

    Agwai, A., Guven, I., & Madenci, E. (2011). A new thermomechanical fracture analysis approach for 3D integration technology. In 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011 (pp. 740-745). [5898595] (Proceedings - Electronic Components and Technology Conference). https://doi.org/10.1109/ECTC.2011.5898595