A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYS

Cagan Diyaroglu, Erdogan Madenci, Selda Oterkus, Erkan Oterkus

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Scopus citations

Abstract

This study presents a novel modeling approach for wetness and moisture concentration in the presence of time dependent saturated moisture concentration by employing the traditional ANSYS thermal and surface effect elements. The accuracy of the present approach is established by comparison with those of the existing ANSYS 'diffusion' and 'coupled field' elements as well as peridynamic theory. The comparison concerns the desorption process in a fully saturated bar made of two different materials with equal and unequal values of solubility activation energy in the presence of time dependent saturated moisture concentration under uniform and nonuniform temperature conditions. The results from the present approach agree well with those of peridynamics and ANSYS 'coupled field' elements if the diffusivity is specified as time dependent. Significant deviation occurs if the diffusivity is specified as temperature dependent. The ANSYS 'diffusion' element is applicable only for uniform temperature, and deviation becomes significant especially for unequal values of solubility activation energy.

Original languageEnglish (US)
Title of host publicationProceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages227-235
Number of pages9
Volume2018-May
ISBN (Print)9781538649985
DOIs
Publication statusPublished - Aug 7 2018
Event68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
Duration: May 29 2018Jun 1 2018

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
CountryUnited States
CitySan Diego
Period5/29/186/1/18

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Keywords

  • Diffusion
  • Finite-element-analysis
  • Moisture
  • Time-dependent

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

Cite this

Diyaroglu, C., Madenci, E., Oterkus, S., & Oterkus, E. (2018). A Novel Finite Element Technique for Moisture Diffusion Modeling Using ANSYS. In Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018 (Vol. 2018-May, pp. 227-235). [8429556] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2018.00043