In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.
- Finite element
ASJC Scopus subject areas
- Control and Systems Engineering
- Signal Processing
- Hardware and Architecture
- Computer Networks and Communications
- Electrical and Electronic Engineering