A novel moisture diffusion modeling approach using finite element analysis

Cagan Diyaroglu, Erdogan Madenci, Selda Oterkus, Erkan Oterkus

Research output: Contribution to journalArticle

Abstract

In this study, a novel wetness and moisture concentration analysis approach is presented. A finite element method is utilized for the solution technique mainly using thermal and surface effect elements. Numerical results obtained from the current approach are compared against other existing finite element-based solutions and the newly introduced peridynamics theory. For numerical analysis, a reflow soldering stage is simulated for a multi-material system with time-dependent saturated moisture concentrations. Different solubility activation energies and temperature conditions are considered. Numerical results demonstrate that the developed methodology can make accurate predictions under different conditions and it is more general than some other existing models which are limited to certain conditions.

Original languageEnglish (US)
Article number438
JournalElectronics (Switzerland)
Volume7
Issue number12
DOIs
StatePublished - Dec 1 2018

Fingerprint

Moisture
Finite element method
Soldering
Numerical analysis
Solubility
Activation energy
Temperature
Hot Temperature

Keywords

  • Concentration
  • Diffusion
  • Finite element
  • Moisture
  • Wetness

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Signal Processing
  • Hardware and Architecture
  • Computer Networks and Communications
  • Electrical and Electronic Engineering

Cite this

A novel moisture diffusion modeling approach using finite element analysis. / Diyaroglu, Cagan; Madenci, Erdogan; Oterkus, Selda; Oterkus, Erkan.

In: Electronics (Switzerland), Vol. 7, No. 12, 438, 01.12.2018.

Research output: Contribution to journalArticle

Diyaroglu, Cagan ; Madenci, Erdogan ; Oterkus, Selda ; Oterkus, Erkan. / A novel moisture diffusion modeling approach using finite element analysis. In: Electronics (Switzerland). 2018 ; Vol. 7, No. 12.
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