A sono-electrochemical technique for enhanced particle removal from tantalum surfaces

R. Balachandran, P. Deymier, S. Raghavan, M. Keswani

Research output: Contribution to journalArticle

6 Scopus citations


Low power megasonics is of interest to semiconductor cleaning community due to minimal feature damage. In this work, megasonic field at low power density in conjunction with electrochemistry is used for enhanced removal of silica particles from tantalum wafers. Cleaning studies were conducted in air or argon saturated aqueous solutions at 0.5W/cm2 in the absence and presence of applied potentials of -1.5 V or -2.0 V to tantalum (vs Ag/AgCl). The improvement in particle removal efficiency is attributed to oscillating hydrogen bubbles formed from water reduction in vicinity of tantalum surface and grown to a resonant size under suitable acoustic conditions.

Original languageEnglish (US)
Pages (from-to)P49-P52
JournalECS Solid State Letters
Issue number5
StatePublished - Mar 14 2014


ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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