Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials

Sunglin Wang, Chris Summitt, Tao Ge, Lee Johnson, Melissa Zaverton, Tom Milster, Yuzuru Takashima

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publicationInternational Conference and Exhibition on Device Packaging 2014
PublisherInternational Microelectronics and Packaging Society, Nordic
Pages280-284
Number of pages5
ISBN (Print)9781632665812
StatePublished - Jan 1 2014
EventIMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference - Scottsdale/Fountain Hills, AZ, United States
Duration: Mar 10 2014Mar 13 2014

Publication series

NameInternational Conference and Exhibition on Device Packaging 2014

Other

OtherIMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference
CountryUnited States
CityScottsdale/Fountain Hills, AZ
Period3/10/143/13/14

Keywords

  • CMOS compatible fabrication
  • Micro optics
  • Optical Coupler
  • Optical via
  • Silicon photonics
  • Three dimensional optical circuit

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Wang, S., Summitt, C., Ge, T., Johnson, L., Zaverton, M., Milster, T., & Takashima, Y. (2014). Alignment process for fabrication of mirror-based optical via using maskless lithography tool with buffer coat materials. In International Conference and Exhibition on Device Packaging 2014 (pp. 280-284). (International Conference and Exhibition on Device Packaging 2014). International Microelectronics and Packaging Society, Nordic.