Abstract
Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.
Original language | English (US) |
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Pages | 1167-1177 |
Number of pages | 11 |
State | Published - Dec 1 2003 |
Event | Hydrometallurgy 2003: Proceedings of the 5th International Symposium - Vancouver, BC, Canada Duration: Aug 24 2003 → Aug 27 2003 |
Other
Other | Hydrometallurgy 2003: Proceedings of the 5th International Symposium |
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Country | Canada |
City | Vancouver, BC |
Period | 8/24/03 → 8/27/03 |
ASJC Scopus subject areas
- Filtration and Separation