Abstract
Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings of the TMS Fall Extraction and Processing Conference |
| Editors | C. Young, A. Alfantazi, C. Anderson, A. James |
| Pages | 1167-1177 |
| Number of pages | 11 |
| Volume | 2 |
| State | Published - 2003 |
| Event | Hydrometallurgy 2003: Proceedings of the 5th International Symposium - Vancouver, BC, Canada Duration: Aug 24 2003 → Aug 27 2003 |
Other
| Other | Hydrometallurgy 2003: Proceedings of the 5th International Symposium |
|---|---|
| Country | Canada |
| City | Vancouver, BC |
| Period | 8/24/03 → 8/27/03 |
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ASJC Scopus subject areas
- Filtration and Separation
Cite this
Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions. / Lee, Jaeheon; Hiskey, J Brent.
Proceedings of the TMS Fall Extraction and Processing Conference. ed. / C. Young; A. Alfantazi; C. Anderson; A. James. Vol. 2 2003. p. 1167-1177.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions
AU - Lee, Jaeheon
AU - Hiskey, J Brent
PY - 2003
Y1 - 2003
N2 - Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.
AB - Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.
UR - http://www.scopus.com/inward/record.url?scp=1642360724&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=1642360724&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:1642360724
VL - 2
SP - 1167
EP - 1177
BT - Proceedings of the TMS Fall Extraction and Processing Conference
A2 - Young, C.
A2 - Alfantazi, A.
A2 - Anderson, C.
A2 - James, A.
ER -