Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions

Research output: Contribution to conferencePaper

2 Scopus citations

Abstract

Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.

Original languageEnglish (US)
Pages1167-1177
Number of pages11
StatePublished - Dec 1 2003
EventHydrometallurgy 2003: Proceedings of the 5th International Symposium - Vancouver, BC, Canada
Duration: Aug 24 2003Aug 27 2003

Other

OtherHydrometallurgy 2003: Proceedings of the 5th International Symposium
CountryCanada
CityVancouver, BC
Period8/24/038/27/03

ASJC Scopus subject areas

  • Filtration and Separation

Fingerprint Dive into the research topics of 'Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions'. Together they form a unique fingerprint.

  • Cite this

    Lee, J., & Hiskey, J. B. (2003). Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions. 1167-1177. Paper presented at Hydrometallurgy 2003: Proceedings of the 5th International Symposium, Vancouver, BC, Canada.