Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions

Jaeheon Lee; J. Brent Hiskey

Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions

Jaeheon Lee, J. Brent Hiskey

Mining and Geological Engineering

Research output: Contribution to conference › Paper › peer-review

2 Scopus citations

Abstract

Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S₂O₃^2-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au₃Cu to AuCu₃. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu₃Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.

Original language	English (US)
Pages	1167-1177
Number of pages	11
State	Published - Dec 1 2003
Event	Hydrometallurgy 2003: Proceedings of the 5th International Symposium - Vancouver, BC, Canada Duration: Aug 24 2003 → Aug 27 2003

Other

Other	Hydrometallurgy 2003: Proceedings of the 5th International Symposium
Country	Canada
City	Vancouver, BC
Period	8/24/03 → 8/27/03

ASJC Scopus subject areas

Filtration and Separation

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title = "Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions",

abstract = "Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.",

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AU - Lee, Jaeheon

AU - Hiskey, J. Brent

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N2 - Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.

AB - Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.

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T2 - Hydrometallurgy 2003: Proceedings of the 5th International Symposium

Y2 - 24 August 2003 through 27 August 2003

ER -

Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions

Abstract

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ASJC Scopus subject areas

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