Abstract
Gold-copper alloys are shown to form during the cementation of gold on copper in a solution containing 0.25M [S2O32-] at 25°C. The alloy composition is strongly dependent on the initial Cu:Au ratio in solution and ranges from Au3Cu to AuCu3. XPS results for Au, Cu, S, and O are reported as a function of depth through an entire deposited film with an initial solution containing 20 ppm [Au] and 30 ppm [Cu]. The deposit contained about 20 atomic % gold and was predominantly Cu3Au. Underpotential deposition (UPD) theory is discussed as a mechanism for explaining the formation of these alloys. Several other systems that produce alloys during contact reduction/cementation are also discussed.
| Original language | English (US) |
|---|---|
| Pages | 1167-1177 |
| Number of pages | 11 |
| State | Published - Dec 1 2003 |
| Event | Hydrometallurgy 2003: Proceedings of the 5th International Symposium - Vancouver, BC, Canada Duration: Aug 24 2003 → Aug 27 2003 |
Other
| Other | Hydrometallurgy 2003: Proceedings of the 5th International Symposium |
|---|---|
| Country | Canada |
| City | Vancouver, BC |
| Period | 8/24/03 → 8/27/03 |
ASJC Scopus subject areas
- Filtration and Separation
Fingerprint Dive into the research topics of 'Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions'. Together they form a unique fingerprint.
Cite this
Lee, J., & Hiskey, J. B. (2003). Alloy formation during the cementation of gold on copper from ammoniacal thiosulfate solutions. 1167-1177. Paper presented at Hydrometallurgy 2003: Proceedings of the 5th International Symposium, Vancouver, BC, Canada.