An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

Yasa Sampurno; Adam Rice; Yun Zhuang; Ara Philipossian

doi:10.1149/1.3589984

An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

Yasa Sampurno, Adam Rice, Yun Zhuang, Ara Philipossian

Chemical and Environmental Engineering

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Abstract

The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

Original language	English (US)
Pages (from-to)	H318-H321
Journal	Electrochemical and Solid-State Letters
Volume	14
Issue number	8
DOIs	https://doi.org/10.1149/1.3589984
State	Published - Jun 22 2011

ASJC Scopus subject areas

Chemical Engineering(all)
Materials Science(all)
Physical and Theoretical Chemistry
Electrochemistry
Electrical and Electronic Engineering

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abstract = "The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.",

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T1 - An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

AU - Sampurno, Yasa

AU - Rice, Adam

AU - Zhuang, Yun

AU - Philipossian, Ara

PY - 2011/6/22

Y1 - 2011/6/22

N2 - The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

AB - The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

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An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

Abstract

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