An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

Yasa Sampurno, Adam Rice, Yun Zhuang, Ara Philipossian

Research output: Contribution to journalArticle

8 Scopus citations

Abstract

The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

Original languageEnglish (US)
JournalElectrochemical and Solid-State Letters
Volume14
Issue number8
DOIs
Publication statusPublished - 2011

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ASJC Scopus subject areas

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

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