An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

Yasa Sampurno; Adam Rice; Yun Zhuang; Ara Philipossian

doi:10.1149/1.3589984

An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

Yasa Sampurno, Adam Rice, Yun Zhuang, Ara Philipossian

Chemical and Environmental Engineering

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8 Scopus citations

Abstract

The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

Original language	English (US)
Journal	Electrochemical and Solid-State Letters
Volume	14
Issue number	8
DOIs	https://doi.org/10.1149/1.3589984
Publication status	Published - 2011

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ASJC Scopus subject areas

Electrochemistry
Electrical and Electronic Engineering
Materials Science(all)
Chemical Engineering(all)
Physical and Theoretical Chemistry

Cite this

Sampurno, Y., Rice, A., Zhuang, Y., & Philipossian, A. (2011). An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization. Electrochemical and Solid-State Letters, 14(8). https://doi.org/10.1149/1.3589984

@article{a2fdbfcfa3f245059476f75ae1b05ea2,

title = "An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization",

abstract = "The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.",

author = "Yasa Sampurno and Adam Rice and Yun Zhuang and Ara Philipossian",

year = "2011",

doi = "10.1149/1.3589984",

language = "English (US)",

volume = "14",

journal = "Electrochemical and Solid-State Letters",

issn = "1099-0062",

publisher = "Electrochemical Society, Inc.",

number = "8",

}

TY - JOUR

T1 - An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization

AU - Sampurno, Yasa

AU - Rice, Adam

AU - Zhuang, Yun

AU - Philipossian, Ara

PY - 2011

Y1 - 2011

N2 - The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

AB - The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.

UR - http://www.scopus.com/inward/record.url?scp=79959218740&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=79959218740&partnerID=8YFLogxK

U2 - 10.1149/1.3589984

DO - 10.1149/1.3589984

M3 - Article

AN - SCOPUS:79959218740

VL - 14

JO - Electrochemical and Solid-State Letters

JF - Electrochemical and Solid-State Letters

SN - 1099-0062

IS - 8

ER -

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10.1149/1.3589984