Abstract
The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.
| Original language | English (US) |
|---|---|
| Journal | Electrochemical and Solid-State Letters |
| Volume | 14 |
| Issue number | 8 |
| DOIs | |
| State | Published - 2011 |
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ASJC Scopus subject areas
- Electrochemistry
- Electrical and Electronic Engineering
- Materials Science(all)
- Chemical Engineering(all)
- Physical and Theoretical Chemistry
Cite this
An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization. / Sampurno, Yasa; Rice, Adam; Zhuang, Yun; Philipossian, Ara.
In: Electrochemical and Solid-State Letters, Vol. 14, No. 8, 2011.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - An approach for correlating friction force and removal rate to pad topography during tungsten chemical mechanical planarization
AU - Sampurno, Yasa
AU - Rice, Adam
AU - Zhuang, Yun
AU - Philipossian, Ara
PY - 2011
Y1 - 2011
N2 - The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.
AB - The evolution of coefficient of friction (COF) and removal rate (RR) during 8.5 h of tungsten CMP is correlated to pad surface topography via a novel pad surface descriptor termed pad surface abruptness'. Interferometric analysis indicates that during the first 2.5 h of polishing, pad surface abruptness remains stable and after 5.5 h, pad surface abruptness decreases (i.e. surface becomes smoother). Results from polishing show similar trends whereby RR and COF are stable during the first 2.5 h period and decrease significantly thereafter. The coefficient of correlation between pad surface abruptness and COF as well as between pad surface abruptness and RR are 0.98 and 0.77, respectively.
UR - http://www.scopus.com/inward/record.url?scp=79959218740&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=79959218740&partnerID=8YFLogxK
U2 - 10.1149/1.3589984
DO - 10.1149/1.3589984
M3 - Article
AN - SCOPUS:79959218740
VL - 14
JO - Electrochemical and Solid-State Letters
JF - Electrochemical and Solid-State Letters
SN - 1099-0062
IS - 8
ER -