An efficient full-wave layered interconnect simulator (UA-FWLIS)

Xing Wang, Zhaohui Zhu, Steven L Dvorak, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

In this paper, efficient analytical methods are used to implement a Full-Wave Layered Interconnect Simulator (UA-FWLIS) that is based on the Method of Moments (MoM). In order to demonstrate these analytical techniques, we first developed a prototype simulator that could only handle thin, single-line stripline structures by modeling the current cells with filamentary expansion and test functions. However, the simple filamentary functions are not valid for modeling the coupling between multiple lines. Therefore, in this paper we discuss the extension of UA-FWLIS to finite-width expansion and test functions so that it can accurately model complex, multiple-line structures. This paper describes how to extend the analytical analysis for computing the elements in the reaction (impedance) matrix from filamentary models to finite-width models. We then validate UA-FWLIS by comparing results with those obtained by Agilent Momentum for some stripline structures including a single transmission line and a coupled-line, band-pass filter. We then compare the computational efficiency of UA-FWLIS with Momentum.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
Pages237-241
Number of pages5
Volume1
Publication statusPublished - 2004
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: Jun 1 2004Jun 4 2004

Other

Other2004 Proceedings - 54th Electronic Components and Technology Conference
CountryUnited States
CityLas Vegas, NV
Period6/1/046/4/04

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Wang, X., Zhu, Z., Dvorak, S. L., & Prince, J. L. (2004). An efficient full-wave layered interconnect simulator (UA-FWLIS). In Proceedings - Electronic Components and Technology Conference (Vol. 1, pp. 237-241)