Analysis of formation of pad stains in copper chemical mechanical planarization

Hyosang Lee, Leonard Borucki, Yun Zhuang, Sooyun Joh, Fergal O'Moore, Ara Philipossian

Research output: Contribution to journalArticle

Abstract

A stain model was developed to simulate stain formation on the pad surface in copper chemical and mechanical planarization (CMP). The model consisted of the incompressible Navier-Stokes equations, the heat equation with advection, material removal rate model, a model for generation, transport and deposition of the polishing by-product that produces the stain. Slurry velocity simulations showed shear flow on the land areas and wafer-driven circulation in the grooves. The simulated temperature on the pad and the wafer surface increased gradually in the radial direction; furthermore, temperature simulations showed a 12 °C rise in the reaction temperature on the copper wafer surface. The simulated pad stains deposited on the copper land areas were darker in the direction of wafer rotation, suggesting that the generated staining agents were advected downstream by the slurry flow and deposited on the pad surface in the direction of the wafer rotation. Simulated stain images were in qualitative agreement with experimental results.

Original languageEnglish (US)
Article number126505
JournalJapanese Journal of Applied Physics
Volume48
Issue number12
DOIs
StatePublished - Dec 2009

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Chemical mechanical polishing
wafers
Copper
copper
Advection
Shear flow
Polishing
Temperature
Navier Stokes equations
Byproducts
staining
advection
polishing
shear flow
machining
grooves
Navier-Stokes equation
temperature
simulation
thermodynamics

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Analysis of formation of pad stains in copper chemical mechanical planarization. / Lee, Hyosang; Borucki, Leonard; Zhuang, Yun; Joh, Sooyun; O'Moore, Fergal; Philipossian, Ara.

In: Japanese Journal of Applied Physics, Vol. 48, No. 12, 126505, 12.2009.

Research output: Contribution to journalArticle

Lee, Hyosang ; Borucki, Leonard ; Zhuang, Yun ; Joh, Sooyun ; O'Moore, Fergal ; Philipossian, Ara. / Analysis of formation of pad stains in copper chemical mechanical planarization. In: Japanese Journal of Applied Physics. 2009 ; Vol. 48, No. 12.
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