Analytical stress singularities for a crack at a Bi- or triple junction of dissimilar materials with bilinear behavior

S. Shkarayev, E. Madenci, M. Ibnabdeljalil, M. P. Savruk

Research output: Contribution to journalArticle

15 Scopus citations

Abstract

The reliability of electronic packages is strongly influenced by the interfacial thermo-mechanical stresses arising from temperature excursions during fabrication and operation. Understanding the mechanisms for relaxing these interfacial thermo-mechanical stresses through the use of appropriate material selection is critical to the enhancement of their reliability. Therefore, this study provides analytical solutions for the asymptotic stress field ahead of the interface crack tip emanating from the apex of a wedge composed of dissimilar materials exhibiting elastic and/or elastic-plastic deformations.

Original languageEnglish (US)
Pages (from-to)475-486
Number of pages12
JournalEngineering Fracture Mechanics
Volume68
Issue number4
DOIs
StatePublished - Mar 1 2001

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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