Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP)

A. Muthukumaran, N. Venkataraman, S. Tamilmani, Srini Raghavan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Hydroxylamine, a weak inorganic amine, etches copper and is considered for use in the planarization (removal of topography) of copper films during the manufacturing of integrated circuits. This paper reports and discusses results obtained from a study on the dissolution behaviour of copper in hydroxylamine solutions at different applied anodic potential values using Quartz Crystal Microbalance (QCM) technique. The dissolution rate of copper in hydroxylamine solution is pH dependant and exhibits a maximum in the vicinity of pH 6. Copper dissolution increases with applied overpotential (η) and dissolution rates as high as 6000 å min- 1 can be obtained at overpotential of 750mV. While both benzotriazole (BTA) and salicylhydroxamic acid (SHA) serve as good inhibitors at lower overpotentials, their effectiveness decreases at higher overpotentials.

Original languageEnglish (US)
Title of host publication47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007
Pages49-56
Number of pages8
StatePublished - 2007
Event47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007 - Sydney, NSW, Australia
Duration: Dec 4 2007Dec 5 2007

Other

Other47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007
CountryAustralia
CitySydney, NSW
Period12/4/0712/5/07

Fingerprint

dissolving
copper
quartz crystals
microbalances
inhibitors
integrated circuits
amines
topography
manufacturing
acids

Keywords

  • Benzotriazole
  • Copper ECMP
  • Hydroxylamine
  • QCM
  • Salicylhydroxamic acid

ASJC Scopus subject areas

  • Surfaces and Interfaces

Cite this

Muthukumaran, A., Venkataraman, N., Tamilmani, S., & Raghavan, S. (2007). Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP). In 47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007 (pp. 49-56)

Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP). / Muthukumaran, A.; Venkataraman, N.; Tamilmani, S.; Raghavan, Srini.

47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007. 2007. p. 49-56.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Muthukumaran, A, Venkataraman, N, Tamilmani, S & Raghavan, S 2007, Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP). in 47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007. pp. 49-56, 47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007, Sydney, NSW, Australia, 12/4/07.
Muthukumaran A, Venkataraman N, Tamilmani S, Raghavan S. Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP). In 47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007. 2007. p. 49-56
Muthukumaran, A. ; Venkataraman, N. ; Tamilmani, S. ; Raghavan, Srini. / Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP). 47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007. 2007. pp. 49-56
@inproceedings{eff8eb7077e24003867cadeeac0d2ede,
title = "Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP)",
abstract = "Hydroxylamine, a weak inorganic amine, etches copper and is considered for use in the planarization (removal of topography) of copper films during the manufacturing of integrated circuits. This paper reports and discusses results obtained from a study on the dissolution behaviour of copper in hydroxylamine solutions at different applied anodic potential values using Quartz Crystal Microbalance (QCM) technique. The dissolution rate of copper in hydroxylamine solution is pH dependant and exhibits a maximum in the vicinity of pH 6. Copper dissolution increases with applied overpotential (η) and dissolution rates as high as 6000 {\aa} min- 1 can be obtained at overpotential of 750mV. While both benzotriazole (BTA) and salicylhydroxamic acid (SHA) serve as good inhibitors at lower overpotentials, their effectiveness decreases at higher overpotentials.",
keywords = "Benzotriazole, Copper ECMP, Hydroxylamine, QCM, Salicylhydroxamic acid",
author = "A. Muthukumaran and N. Venkataraman and S. Tamilmani and Srini Raghavan",
year = "2007",
language = "English (US)",
isbn = "9781622762439",
pages = "49--56",
booktitle = "47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007",

}

TY - GEN

T1 - Anodic dissolution of copper in hydroxylamine based solutions with special reference to electrochemical mechanical planarization (ECMP)

AU - Muthukumaran, A.

AU - Venkataraman, N.

AU - Tamilmani, S.

AU - Raghavan, Srini

PY - 2007

Y1 - 2007

N2 - Hydroxylamine, a weak inorganic amine, etches copper and is considered for use in the planarization (removal of topography) of copper films during the manufacturing of integrated circuits. This paper reports and discusses results obtained from a study on the dissolution behaviour of copper in hydroxylamine solutions at different applied anodic potential values using Quartz Crystal Microbalance (QCM) technique. The dissolution rate of copper in hydroxylamine solution is pH dependant and exhibits a maximum in the vicinity of pH 6. Copper dissolution increases with applied overpotential (η) and dissolution rates as high as 6000 å min- 1 can be obtained at overpotential of 750mV. While both benzotriazole (BTA) and salicylhydroxamic acid (SHA) serve as good inhibitors at lower overpotentials, their effectiveness decreases at higher overpotentials.

AB - Hydroxylamine, a weak inorganic amine, etches copper and is considered for use in the planarization (removal of topography) of copper films during the manufacturing of integrated circuits. This paper reports and discusses results obtained from a study on the dissolution behaviour of copper in hydroxylamine solutions at different applied anodic potential values using Quartz Crystal Microbalance (QCM) technique. The dissolution rate of copper in hydroxylamine solution is pH dependant and exhibits a maximum in the vicinity of pH 6. Copper dissolution increases with applied overpotential (η) and dissolution rates as high as 6000 å min- 1 can be obtained at overpotential of 750mV. While both benzotriazole (BTA) and salicylhydroxamic acid (SHA) serve as good inhibitors at lower overpotentials, their effectiveness decreases at higher overpotentials.

KW - Benzotriazole

KW - Copper ECMP

KW - Hydroxylamine

KW - QCM

KW - Salicylhydroxamic acid

UR - http://www.scopus.com/inward/record.url?scp=84867820493&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84867820493&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:84867820493

SN - 9781622762439

SP - 49

EP - 56

BT - 47th Annual Conference of the Australasian Corrosion Association 2007: Corrosion Control 2007

ER -