Application of slurry injection system (SIS) to advanced deep-trench (DT) CMP

Amarnath Jha, Derek Stoll, Wei Tsu Tseng, Changhong Wu, Ji Chul Yang, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A slurry injection system (SIS) from Araca Inc. is installed on a single-platen, single-carrier, 300 mm polisher and evaluated for 14 nm deep-trench (DT) CMP process. A 40 % reduction in slurry flow rate with equivalent removal rates and improved within-wafer oxide uniformity are demonstrated. A 400-wafer marathon run with SIS at 40 % reduced slurry flow rate shows stable rates without degradation in within-wafer uniformity and defectivity.

Original languageEnglish (US)
Title of host publicationICPT 2017 - International Conference on Planarization/CMP Technology
PublisherVDE Verlag GmbH
Pages136-141
Number of pages6
ISBN (Electronic)9783800744626
StatePublished - 2017
Externally publishedYes
Event2017 International Conference on Planarization/CMP Technology, ICPT 2017 - Leuven, Belgium
Duration: Oct 11 2017Oct 13 2017

Publication series

NameICPT 2017 - International Conference on Planarization/CMP Technology

Conference

Conference2017 International Conference on Planarization/CMP Technology, ICPT 2017
CountryBelgium
CityLeuven
Period10/11/1710/13/17

Keywords

  • Chemical-mechanical Planarization
  • Cost reduction
  • Deep-trench isolation
  • Slurry Injection System
  • Slurry application

ASJC Scopus subject areas

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

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