Applications of germanium to low temperature micro-machining

Biao Li, Bin Xiong, Linan Jiang, Yitshak Zohar, Man Wong

Research output: Contribution to conferencePaper

6 Scopus citations

Abstract

Though germanium (Ge) shares similar physical properties with silicon (Si), it also possesses unique characteristics that are complementary to those of Si. The advantages of Ge include its compatibility with Si micro-fabrication, its excellent gas and liquid phase etch selectivity to other materials commonly used in Si micro-machining, and particularly its low deposition temperature (<350 °C) which allows Ge to be used after the completion of a standard CMOS run. Clearly, wider applications of Ge as structural, sacrificial, and sensor material require a more systematic investigation of its processing and properties. In this report, the results of a systematic investigation of the use of Ge in MEMS are presented.

Original languageEnglish (US)
Pages638-643
Number of pages6
StatePublished - Jan 1 1999
Externally publishedYes
EventProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS - Orlando, FL, USA
Duration: Jan 17 1999Jan 21 1999

Other

OtherProceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS
CityOrlando, FL, USA
Period1/17/991/21/99

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Li, B., Xiong, B., Jiang, L., Zohar, Y., & Wong, M. (1999). Applications of germanium to low temperature micro-machining. 638-643. Paper presented at Proceedings of the 1999 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS, Orlando, FL, USA, .