AUGER ELECTRON SPECTROSCOPIC DEPTH PROFILING TECHNIQUES APPLIED TO ULTRATHIN ELECTROCHEMICALLY DEPOSITED METAL LAYERS.

M. L. Knotek, Rod K. Quinn, N. R. Armstrong, N. E. Vanderborgh

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The Auger electron spectroscopic depth profiling technique is applied to the study of the initial equivalent monolayer of electrodeposited Ag on thin-film Pt electrodes. The ultimate depth resolution of this technique is determined by examining ultrathin layers of Ag which have been ion deposited from a zeolite source in ultrahigh vacuum. The exponential decay apparent in the examination of such layers is explained from elementary considerations of the sputtering process. These are seen to be the resolution-limiting factor for these layers. The depth resolution is shown to be of the order of 5 Angstrom. Examination of monolayer and submonolayer films of Ag electrodeposited from an AgClO//4/sulfolane solution shows that there is an adsorbed overlayer of S (of solvent origin), followed by the electrodeposited Ag film, which is rich in Cl(of solute origin), followed by the Pt substrate, which also contains high levels of Cl.

Original languageEnglish (US)
Pages (from-to)705-710
Number of pages6
JournalJ Vac Sci Technol
Volume14
Issue number2
DOIs
StatePublished - Jan 1 1977
Externally publishedYes

ASJC Scopus subject areas

  • Engineering(all)

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