Biaxial compression of a thin layer with circular debonding over a substrate

Erdogan Madenci, H. Balkan, M. Quan

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

This paper presents an analytical solution to the problem of a circular debonded thin film on a substrate subjected to biaxial compressive residual stresses. Contaminated regions may be the source of debonding during fabrication, and compressive stresses are induced in the film during the cooling stage of the fabrication process. The presence of such defects may influence the thermal/mechanical integrity of, for example, microelectronic devices. The stress intensity factors for this problem are obtained by solving a system of singular integral equations.

Original languageEnglish (US)
Pages (from-to)3465-3477
Number of pages13
JournalInternational Journal of Solids and Structures
Volume32
Issue number23
DOIs
StatePublished - 1995

Fingerprint

Debonding
Biaxial
Thin Layer
Compressive stress
Fabrication
Compression
Substrate
singular integral equations
fabrication
stress intensity factors
Singular Integral Equation
Residual Stress
Substrates
Stress Intensity Factor
microelectronics
Microelectronics
Stress intensity factors
integrity
Integrity
Integral equations

ASJC Scopus subject areas

  • Mechanical Engineering
  • Mechanics of Materials
  • Materials Science(all)
  • Applied Mathematics
  • Modeling and Simulation
  • Condensed Matter Physics

Cite this

Biaxial compression of a thin layer with circular debonding over a substrate. / Madenci, Erdogan; Balkan, H.; Quan, M.

In: International Journal of Solids and Structures, Vol. 32, No. 23, 1995, p. 3465-3477.

Research output: Contribution to journalArticle

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