Bio-MEMS sensors for real-time shear stress on endothelial cell dynamics

Tzung K. Hsiai, Sung K. Cho, Pak Kin Wong, Michael Ing, Mohammad Navab, Srinuvasa Reddy, Linda L. Demer, Chih M. Ho

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

Precise characterization of shear stress in the arterial trees is critical to elucidate the effects of spatial versus temporal shear stress gradients on the biological activities of endothelial cells (EC). We developed micro electrical mechanical systems (MEMS) sensors, comparable to the size of EC (2 × 80 μm), to deliver the spatial and temporal resolution necessary at a frequency response > 100 Hz. We provided the first in vitro evidence of real-time wall shear stress on EC couple with real-time gene expression of monocyte chemoattractant protein (MCP-1).

Original languageEnglish (US)
Title of host publicationAnnual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings
Pages1828-1829
Number of pages2
Volume3
Publication statusPublished - 2002
Externally publishedYes
EventProceedings of the 2002 IEEE Engineering in Medicine and Biology 24th Annual Conference and the 2002 Fall Meeting of the Biomedical Engineering Society (BMES / EMBS) - Houston, TX, United States
Duration: Oct 23 2002Oct 26 2002

Other

OtherProceedings of the 2002 IEEE Engineering in Medicine and Biology 24th Annual Conference and the 2002 Fall Meeting of the Biomedical Engineering Society (BMES / EMBS)
CountryUnited States
CityHouston, TX
Period10/23/0210/26/02

    Fingerprint

Keywords

  • Endothelial cells
  • Micro electro mechanical systems (MEMS)
  • Monocytes
  • Shear stress

ASJC Scopus subject areas

  • Bioengineering

Cite this

Hsiai, T. K., Cho, S. K., Wong, P. K., Ing, M., Navab, M., Reddy, S., ... Ho, C. M. (2002). Bio-MEMS sensors for real-time shear stress on endothelial cell dynamics. In Annual International Conference of the IEEE Engineering in Medicine and Biology - Proceedings (Vol. 3, pp. 1828-1829)