Boundary conditions and integrated sensors in microchannel convective heat transfer

Man Lee, Luthur Siu Lun Cheung, Yi Kuen Lee, Yitshak Zohar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A microchannel heat sink, integrated with pressure and temperature microsensors, is fabricated to study convective boiling under uniform heat flux boundary condition. Utilizing a wafer bond and etch back technology, the heat source, temperature and pressure sensors are separated from the fluid flow by a membrane only 1.5μm in thickness; thus, allowing good control of the thermal boundary conditions. Temperature and pressure distributions for various power levels and flow rates are measured while, simultaneously, the flow patterns are recorded. Single-phase flow results, compared with numerical simulations, confirm that the heat flux boundary condition is indeed nearly uniform. The sensor arrays, particularly for two-phase flow, provide the spatial and temporal dependence of both the temperature and pressures fields.

Original languageEnglish (US)
Title of host publicationProceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
Pages1365-1371
Number of pages7
StatePublished - Dec 1 2006
Event4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006 - Limerick, Ireland
Duration: Jun 19 2006Jun 21 2006

Publication series

NameProceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
Volume2006 B

Other

Other4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006
CountryIreland
CityLimerick
Period6/19/066/21/06

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Boundary conditions and integrated sensors in microchannel convective heat transfer'. Together they form a unique fingerprint.

  • Cite this

    Lee, M., Cheung, L. S. L., Lee, Y. K., & Zohar, Y. (2006). Boundary conditions and integrated sensors in microchannel convective heat transfer. In Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006 (pp. 1365-1371). (Proceedings of the 4th International Conference on Nanochannels, Microchannels and Minichannels, ICNMM2006; Vol. 2006 B).