Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate

Humayun Kabir, Alfonso Ortega, Cholik Chan

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A novel formulation is presented for solving the conjugate heat transfer that arises due to a thin flush heat source mounted on a conductive substrate. The unique formulation allows one to couple a wide variety of flow models to the solid conduction. The solid side is modeled with a Boundary Element Method (BEM). The temperature field in the fluid side is not explicitly solved, rather, analytical 'step temperature' solutions, relevant to the particular flow model, are used to express convective heat flux as a function of interface temperatures. A noniterative solution for the conjugate problem is found by matching the temperature and the fluxes at the solid-fluid interface. Results of a parametric study of the effects of board conduction on component thermal performance are presented.

Original languageEnglish (US)
Pages (from-to)108-116
Number of pages9
JournalIEEE transactions on components, packaging, and manufacturing technology. Part A
Volume18
Issue number1
DOIs
StatePublished - Mar 1995

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Heat transfer
Substrates
Fluids
Boundary element method
Temperature
Heat flux
Temperature distribution
Fluxes
Hot Temperature

ASJC Scopus subject areas

  • Engineering(all)

Cite this

@article{a289b432f1504d8481287e90b66eb260,
title = "Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate",
abstract = "A novel formulation is presented for solving the conjugate heat transfer that arises due to a thin flush heat source mounted on a conductive substrate. The unique formulation allows one to couple a wide variety of flow models to the solid conduction. The solid side is modeled with a Boundary Element Method (BEM). The temperature field in the fluid side is not explicitly solved, rather, analytical 'step temperature' solutions, relevant to the particular flow model, are used to express convective heat flux as a function of interface temperatures. A noniterative solution for the conjugate problem is found by matching the temperature and the fluxes at the solid-fluid interface. Results of a parametric study of the effects of board conduction on component thermal performance are presented.",
author = "Humayun Kabir and Alfonso Ortega and Cholik Chan",
year = "1995",
month = "3",
doi = "10.1109/95.370743",
language = "English (US)",
volume = "18",
pages = "108--116",
journal = "IEEE Transactions on Components Packaging and Manufacturing Technology Part A",
issn = "1070-9886",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "1",

}

TY - JOUR

T1 - Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate

AU - Kabir, Humayun

AU - Ortega, Alfonso

AU - Chan, Cholik

PY - 1995/3

Y1 - 1995/3

N2 - A novel formulation is presented for solving the conjugate heat transfer that arises due to a thin flush heat source mounted on a conductive substrate. The unique formulation allows one to couple a wide variety of flow models to the solid conduction. The solid side is modeled with a Boundary Element Method (BEM). The temperature field in the fluid side is not explicitly solved, rather, analytical 'step temperature' solutions, relevant to the particular flow model, are used to express convective heat flux as a function of interface temperatures. A noniterative solution for the conjugate problem is found by matching the temperature and the fluxes at the solid-fluid interface. Results of a parametric study of the effects of board conduction on component thermal performance are presented.

AB - A novel formulation is presented for solving the conjugate heat transfer that arises due to a thin flush heat source mounted on a conductive substrate. The unique formulation allows one to couple a wide variety of flow models to the solid conduction. The solid side is modeled with a Boundary Element Method (BEM). The temperature field in the fluid side is not explicitly solved, rather, analytical 'step temperature' solutions, relevant to the particular flow model, are used to express convective heat flux as a function of interface temperatures. A noniterative solution for the conjugate problem is found by matching the temperature and the fluxes at the solid-fluid interface. Results of a parametric study of the effects of board conduction on component thermal performance are presented.

UR - http://www.scopus.com/inward/record.url?scp=0029273811&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029273811&partnerID=8YFLogxK

U2 - 10.1109/95.370743

DO - 10.1109/95.370743

M3 - Article

AN - SCOPUS:0029273811

VL - 18

SP - 108

EP - 116

JO - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

JF - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

SN - 1070-9886

IS - 1

ER -