Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate

Humayun Kabir, Alfonso Ortega, Cholik Chan, John L. Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel formulation is presented for solving the conjugate heat transfer problem that arises due to a thin flush heat source mounted on a conductive substrate. The geometry is a paradigm for direct air cooling of components on conducting boards. PCB thermal algorithms based on this approach are being developed for rapid estimation of the thermal field in a direct air cooled board. The algorithms are part of a suite of tools for integrated electronic packaging design being developed at the Center for Electronic Packaging Research (CEPR). This paper presents the formulation of the approach and demonstrates its utilization for parametric studies of board level thermal management, in particular for studying the effects of board conductivity. The unique formulation allows one to couple a wide variety of flow models to the solid conduction. The solid side is modelled with a Boundary Element Method (BEM). The temperature field in the fluid side is not explicitly solved, rather, analytical 'step temperature' solutions, relevant to the particular flow model, are used to express convective heat flux as a function of interface temperatures. A non-iterative solution for the conjugate problem is found by matching the temperatures and fluxes at the solid-fluid interface. Results of a parametric study of the effects of board conduction on component thermal performance are presented.

Original languageEnglish (US)
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherPubl by IEEE
Pages403-410
Number of pages8
ISBN (Print)0780309154
StatePublished - 1994
EventProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference - Washington, DC, USA
Duration: May 1 1994May 4 1994

Other

OtherProceedings of the 1994 IEEE 44th Electronic Components & Technology Conference
CityWashington, DC, USA
Period5/1/945/4/94

Fingerprint

Heat transfer
Electronics packaging
Substrates
Fluids
Boundary element method
Air
Polychlorinated biphenyls
Temperature control
Temperature
Heat flux
Temperature distribution
Fluxes
Cooling
Geometry
Hot Temperature

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Kabir, H., Ortega, A., Chan, C., & Prince, J. L. (1994). Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate. In Proceedings - Electronic Components and Technology Conference (pp. 403-410). Publ by IEEE.

Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate. / Kabir, Humayun; Ortega, Alfonso; Chan, Cholik; Prince, John L.

Proceedings - Electronic Components and Technology Conference. Publ by IEEE, 1994. p. 403-410.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kabir, H, Ortega, A, Chan, C & Prince, JL 1994, Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate. in Proceedings - Electronic Components and Technology Conference. Publ by IEEE, pp. 403-410, Proceedings of the 1994 IEEE 44th Electronic Components & Technology Conference, Washington, DC, USA, 5/1/94.
Kabir H, Ortega A, Chan C, Prince JL. Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate. In Proceedings - Electronic Components and Technology Conference. Publ by IEEE. 1994. p. 403-410
Kabir, Humayun ; Ortega, Alfonso ; Chan, Cholik ; Prince, John L. / Boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a substrate. Proceedings - Electronic Components and Technology Conference. Publ by IEEE, 1994. pp. 403-410
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