Brush Scrubbing for Post-CMP Cleaning

Ting Sun, Zhenxing Han, Manish Keswani

Research output: ResearchChapter

Abstract

To achieve a defect-free wafer surface, slurry residuals and other contaminants are required to be removed after a chemical mechanical planarization (CMP) process. Brush scrubbing, a process based on direct contact between a soft polyvinyl alcohol (PVA) brush and the wafer surface is widely accepted in post-CMP cleaning due to process flexibility, single-wafer processing configuration, and reduced cost of ownership. Researches have shown that the cleaning performance of the brush scrubbing process depends on the cleaning chemistry, tool kinematics, and properties of PVA brushes. This chapter reviews and summarizes current and past work on brush scrubbing and discusses the important aspects of cleaning mechanism, tool kinematics, and consumables.

LanguageEnglish (US)
Title of host publicationMethods for Surface Cleaning
PublisherElsevier Inc.
Pages109-133
Number of pages25
Volume9
ISBN (Electronic)9780323431729
ISBN (Print)9780323431576
DOIs
StatePublished - Nov 11 2016

Fingerprint

Chemical mechanical polishing
Brushes
Cleaning
Polyvinyl alcohols
Kinematics
Polyvinyl Alcohol
Impurities
Defects
Processing
Costs

Keywords

  • Brush scrubbing
  • Cleaning chemistry
  • Post-CMP cleaning
  • PVA brush
  • Tool kinematics

ASJC Scopus subject areas

  • Engineering(all)
  • Materials Science(all)

Cite this

Sun, T., Han, Z., & Keswani, M. (2016). Brush Scrubbing for Post-CMP Cleaning. In Methods for Surface Cleaning (Vol. 9, pp. 109-133). Elsevier Inc.. DOI: 10.1016/B978-0-323-43157-6.00004-5

Brush Scrubbing for Post-CMP Cleaning. / Sun, Ting; Han, Zhenxing; Keswani, Manish.

Methods for Surface Cleaning. Vol. 9 Elsevier Inc., 2016. p. 109-133.

Research output: ResearchChapter

Sun, T, Han, Z & Keswani, M 2016, Brush Scrubbing for Post-CMP Cleaning. in Methods for Surface Cleaning. vol. 9, Elsevier Inc., pp. 109-133. DOI: 10.1016/B978-0-323-43157-6.00004-5
Sun T, Han Z, Keswani M. Brush Scrubbing for Post-CMP Cleaning. In Methods for Surface Cleaning. Vol. 9. Elsevier Inc.2016. p. 109-133. Available from, DOI: 10.1016/B978-0-323-43157-6.00004-5
Sun, Ting ; Han, Zhenxing ; Keswani, Manish. / Brush Scrubbing for Post-CMP Cleaning. Methods for Surface Cleaning. Vol. 9 Elsevier Inc., 2016. pp. 109-133
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