Bump bonded back illuminated ccds

M. P. Lesser, Ann Bauer, Lee Ulrickson, David Ouellette

Research output: Contribution to journalConference article

11 Scopus citations

Abstract

We have developed a thinning and packaging process which allows the conversion of front-illuminated charge-coupled devices (CCDs) into back illuminated sensors. This process does not depend on any special processing by the manufacturer and can therefore be used with any type of CCD. The process consists of several major steps which include: 1) making a silicon substrate with conductive traces and indium bumps which mate to the CCD wire bonding pads, 2) placing indium bumps on the CCD wire bonding pads, 3) bump bonding the substrate and CCD together, 4) thinning, 5)packaging, 6) oxidizing the backside surface, 7) applying antireflection coatings, and 8) backside charging. Using this process with Loral 1200x800 and 3072x1024 CCDs, we have produced devices with quantum efficiency in excess of 80% in the near-UV and visible wavelength regions. The surface flatness of these devices has been measured interferometrically to deviate from a plane by less than 1 um rms for the 1200x800 pixel sensors.

Original languageEnglish (US)
Pages (from-to)508-516
Number of pages9
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume1656
DOIs
Publication statusPublished - Aug 12 1992
Externally publishedYes
EventHigh-Resolution Sensors and Hybrid Systems 1992 - San Jose, United States
Duration: Feb 9 1992Feb 14 1992

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ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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