Causal analysis of conditioner design factors on removal rates in copper CMP

L. Borucki, N. Rikita, Y. Zhuang, H. Lee, R. Zhuang, T. Yamashita, R. Kikuma, A. Philipossian

Research output: Contribution to conferencePaper

3 Scopus citations

Abstract

A theory of conditioning, friction, and material removal is outlined that connects pad surface topography from conditioning with removal rates. The theory predicts a priori that friction and removal rate should both decrease as the conditioned surface becomes less abrupt. Simple models of cut rate and active diamond count also further indicate that abruptness should decrease with increasing conditioner load. Three Mitsubishi Materials Corporation conditioners with different grit sizes are used to test the theory in an experiment in which the conditioner load is varied from light to heavy. Polishing experiments and pad profilometry verify the main predictions of the theory.

Original languageEnglish (US)
Pages272-279
Number of pages8
StatePublished - Dec 1 2006
Event11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006 - Fremont, CA, United States
Duration: Feb 21 2006Feb 23 2006

Other

Other11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006
CountryUnited States
CityFremont, CA
Period2/21/062/23/06

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Borucki, L., Rikita, N., Zhuang, Y., Lee, H., Zhuang, R., Yamashita, T., Kikuma, R., & Philipossian, A. (2006). Causal analysis of conditioner design factors on removal rates in copper CMP. 272-279. Paper presented at 11th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2006, Fremont, CA, United States.