Characterization of cavitation in a single wafer or photomask cleaning tool

Xi Chen, Petrie Yam, Manish Keswani, Nagaya Okada, Claudio I. Zanelli

Research output: ResearchConference contribution

Abstract

A novel transducer for megasonic cleaning of photomasks presents an approach that differs from previous configurations, and appears to have unique features for cleaning while minimizing damage. As the cleaning and damage processes are determined by the presence of cavitation, a thorough acoustic analysis was performed on the device, by using a calibrated hydrophone scanned at the photomask location, and a quartz photomask with embedded sensors.

LanguageEnglish (US)
Title of host publicationUltra Clean Processing of Semiconductor Surfaces XIII
PublisherTrans Tech Publications Ltd
Pages207-212
Number of pages6
Volume255
ISBN (Print)9783035710847
DOIs
StatePublished - 2016
Event13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016 - Knokke, Belgium
Duration: Sep 12 2016Sep 14 2016

Publication series

NameSolid State Phenomena
Volume255
ISSN (Electronic)16629779

Other

Other13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016
CountryBelgium
CityKnokke
Period9/12/169/14/16

Fingerprint

photomasks
cavitation flow
cleaning
wafers
Photomasks
Cavitation
Cleaning
damage
hydrophones
transducers
quartz
acoustics
sensors
configurations
Hydrophones
Quartz
Transducers
Acoustics
Sensors

Keywords

  • Cavitation
  • Cleaning
  • Hydrophone
  • Megasonic
  • Microstreaming
  • Photomask
  • Sensor Array
  • Transient
  • Ultrasonic

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Chen, X., Yam, P., Keswani, M., Okada, N., & Zanelli, C. I. (2016). Characterization of cavitation in a single wafer or photomask cleaning tool. In Ultra Clean Processing of Semiconductor Surfaces XIII (Vol. 255, pp. 207-212). (Solid State Phenomena; Vol. 255). Trans Tech Publications Ltd. DOI: 10.4028/www.scientific.net/SSP.255.207

Characterization of cavitation in a single wafer or photomask cleaning tool. / Chen, Xi; Yam, Petrie; Keswani, Manish; Okada, Nagaya; Zanelli, Claudio I.

Ultra Clean Processing of Semiconductor Surfaces XIII. Vol. 255 Trans Tech Publications Ltd, 2016. p. 207-212 (Solid State Phenomena; Vol. 255).

Research output: ResearchConference contribution

Chen, X, Yam, P, Keswani, M, Okada, N & Zanelli, CI 2016, Characterization of cavitation in a single wafer or photomask cleaning tool. in Ultra Clean Processing of Semiconductor Surfaces XIII. vol. 255, Solid State Phenomena, vol. 255, Trans Tech Publications Ltd, pp. 207-212, 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016, Knokke, Belgium, 9/12/16. DOI: 10.4028/www.scientific.net/SSP.255.207
Chen X, Yam P, Keswani M, Okada N, Zanelli CI. Characterization of cavitation in a single wafer or photomask cleaning tool. In Ultra Clean Processing of Semiconductor Surfaces XIII. Vol. 255. Trans Tech Publications Ltd. 2016. p. 207-212. (Solid State Phenomena). Available from, DOI: 10.4028/www.scientific.net/SSP.255.207
Chen, Xi ; Yam, Petrie ; Keswani, Manish ; Okada, Nagaya ; Zanelli, Claudio I./ Characterization of cavitation in a single wafer or photomask cleaning tool. Ultra Clean Processing of Semiconductor Surfaces XIII. Vol. 255 Trans Tech Publications Ltd, 2016. pp. 207-212 (Solid State Phenomena).
@inbook{b306b587b71744548631f7c27e0fcfbc,
title = "Characterization of cavitation in a single wafer or photomask cleaning tool",
abstract = "A novel transducer for megasonic cleaning of photomasks presents an approach that differs from previous configurations, and appears to have unique features for cleaning while minimizing damage. As the cleaning and damage processes are determined by the presence of cavitation, a thorough acoustic analysis was performed on the device, by using a calibrated hydrophone scanned at the photomask location, and a quartz photomask with embedded sensors.",
keywords = "Cavitation, Cleaning, Hydrophone, Megasonic, Microstreaming, Photomask, Sensor Array, Transient, Ultrasonic",
author = "Xi Chen and Petrie Yam and Manish Keswani and Nagaya Okada and Zanelli, {Claudio I.}",
year = "2016",
doi = "10.4028/www.scientific.net/SSP.255.207",
isbn = "9783035710847",
volume = "255",
series = "Solid State Phenomena",
publisher = "Trans Tech Publications Ltd",
pages = "207--212",
booktitle = "Ultra Clean Processing of Semiconductor Surfaces XIII",

}

TY - CHAP

T1 - Characterization of cavitation in a single wafer or photomask cleaning tool

AU - Chen,Xi

AU - Yam,Petrie

AU - Keswani,Manish

AU - Okada,Nagaya

AU - Zanelli,Claudio I.

PY - 2016

Y1 - 2016

N2 - A novel transducer for megasonic cleaning of photomasks presents an approach that differs from previous configurations, and appears to have unique features for cleaning while minimizing damage. As the cleaning and damage processes are determined by the presence of cavitation, a thorough acoustic analysis was performed on the device, by using a calibrated hydrophone scanned at the photomask location, and a quartz photomask with embedded sensors.

AB - A novel transducer for megasonic cleaning of photomasks presents an approach that differs from previous configurations, and appears to have unique features for cleaning while minimizing damage. As the cleaning and damage processes are determined by the presence of cavitation, a thorough acoustic analysis was performed on the device, by using a calibrated hydrophone scanned at the photomask location, and a quartz photomask with embedded sensors.

KW - Cavitation

KW - Cleaning

KW - Hydrophone

KW - Megasonic

KW - Microstreaming

KW - Photomask

KW - Sensor Array

KW - Transient

KW - Ultrasonic

UR - http://www.scopus.com/inward/record.url?scp=84988383012&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84988383012&partnerID=8YFLogxK

U2 - 10.4028/www.scientific.net/SSP.255.207

DO - 10.4028/www.scientific.net/SSP.255.207

M3 - Conference contribution

SN - 9783035710847

VL - 255

T3 - Solid State Phenomena

SP - 207

EP - 212

BT - Ultra Clean Processing of Semiconductor Surfaces XIII

PB - Trans Tech Publications Ltd

ER -