Characterization of cavitation in a single wafer or photomask cleaning tool

Xi Chen, Petrie Yam, Manish Keswani, Nagaya Okada, Claudio I. Zanelli

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A novel transducer for megasonic cleaning of photomasks presents an approach that differs from previous configurations, and appears to have unique features for cleaning while minimizing damage. As the cleaning and damage processes are determined by the presence of cavitation, a thorough acoustic analysis was performed on the device, by using a calibrated hydrophone scanned at the photomask location, and a quartz photomask with embedded sensors.

Original languageEnglish (US)
Title of host publicationUltra Clean Processing of Semiconductor Surfaces XIII
EditorsPaul W. Mertens, Marc Meuris, Marc Meuris, Marc Heyns
PublisherTrans Tech Publications Ltd
Pages207-212
Number of pages6
ISBN (Print)9783035710847
DOIs
StatePublished - Jan 1 2016
Event13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016 - Knokke, Belgium
Duration: Sep 12 2016Sep 14 2016

Publication series

NameSolid State Phenomena
Volume255
ISSN (Print)1012-0394
ISSN (Electronic)1662-9779

Other

Other13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces , UCPSS 2016
CountryBelgium
CityKnokke
Period9/12/169/14/16

Keywords

  • Cavitation
  • Cleaning
  • Hydrophone
  • Megasonic
  • Microstreaming
  • Photomask
  • Sensor Array
  • Transient
  • Ultrasonic

ASJC Scopus subject areas

  • Atomic and Molecular Physics, and Optics
  • Materials Science(all)
  • Condensed Matter Physics

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  • Cite this

    Chen, X., Yam, P., Keswani, M., Okada, N., & Zanelli, C. I. (2016). Characterization of cavitation in a single wafer or photomask cleaning tool. In P. W. Mertens, M. Meuris, M. Meuris, & M. Heyns (Eds.), Ultra Clean Processing of Semiconductor Surfaces XIII (pp. 207-212). (Solid State Phenomena; Vol. 255). Trans Tech Publications Ltd. https://doi.org/10.4028/www.scientific.net/SSP.255.207