Characterization of microstrip interconnects over gridded ground planes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An equivalent circuit and modeling approach for microstrip packaging interconnects over a gridded ground plane are proposed. The equivalent characteristic imnpedance and propagation constant of the line are derived. The modeling approach is verified by frequency/time domain measurements.

Original languageEnglish (US)
Title of host publication14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages75-78
Number of pages4
DOIs
StatePublished - Dec 1 2005
Event14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States
Duration: Oct 24 2005Oct 26 2005

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume2005

Other

Other14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Country/TerritoryUnited States
CityAustin, TX
Period10/24/0510/26/05

ASJC Scopus subject areas

  • Engineering(all)

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