Characterization of microstrip interconnects over gridded ground planes

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

An equivalent circuit and modeling approach for microstrip packaging interconnects over a gridded ground plane are proposed. The equivalent characteristic imnpedance and propagation constant of the line are derived. The modeling approach is verified by frequency/time domain measurements.

Original languageEnglish (US)
Title of host publication14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
Pages75-78
Number of pages4
DOIs
StatePublished - Dec 1 2005
Event14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 - Austin, TX, United States
Duration: Oct 24 2005Oct 26 2005

Publication series

NameIEEE Topical Meeting on Electrical Performance of Electronic Packaging
Volume2005

Other

Other14th Topical Meeting on Electrical Performance of Electronic Packaging 2005
CountryUnited States
CityAustin, TX
Period10/24/0510/26/05

ASJC Scopus subject areas

  • Engineering(all)

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  • Cite this

    Lin, Z., & Melde, K. L. (2005). Characterization of microstrip interconnects over gridded ground planes. In 14th Topical Meeting on Electrical Performance of Electronic Packaging 2005 (pp. 75-78). [1563705] (IEEE Topical Meeting on Electrical Performance of Electronic Packaging; Vol. 2005). https://doi.org/10.1109/EPEP.2005.1563705