Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

Hyosang Lee, Yoshiyuki Seike, Zhonglin Li, Yun Zhuang, Mineo Takaoka, Keiji Miyachi, Ara Philipossian

Research output: Contribution to journalArticle

2 Scopus citations

Abstract

Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

Original languageEnglish (US)
Pages (from-to)L1325-L1327
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume45
Issue number46-50
DOIs
StatePublished - Dec 1 2006

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Keywords

  • Chemical mechanical planarization (CMP)
  • High pressure micro jet (HPMJ) pad conditioning
  • Slurry residues
  • UV-enhanced fluorescence (UVEF) technique

ASJC Scopus subject areas

  • Engineering(all)
  • Physics and Astronomy (miscellaneous)
  • Physics and Astronomy(all)

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