Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

Hyosang Lee, Yoshiyuki Seike, Zhonglin Li, Yun Zhuang, Mineo Takaoka, Keiji Miyachi, Ara Philipossian

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

Original languageEnglish (US)
JournalJapanese Journal of Applied Physics, Part 2: Letters
Volume45
Issue number46-50
DOIs
StatePublished - Dec 2006

Fingerprint

conditioning
grooves
Diamonds
diamonds
Fluorescence
wafers
fluorescence

Keywords

  • Chemical mechanical planarization (CMP)
  • High pressure micro jet (HPMJ) pad conditioning
  • Slurry residues
  • UV-enhanced fluorescence (UVEF) technique

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

Cite this

Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes. / Lee, Hyosang; Seike, Yoshiyuki; Li, Zhonglin; Zhuang, Yun; Takaoka, Mineo; Miyachi, Keiji; Philipossian, Ara.

In: Japanese Journal of Applied Physics, Part 2: Letters, Vol. 45, No. 46-50, 12.2006.

Research output: Contribution to journalArticle

Lee, Hyosang ; Seike, Yoshiyuki ; Li, Zhonglin ; Zhuang, Yun ; Takaoka, Mineo ; Miyachi, Keiji ; Philipossian, Ara. / Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes. In: Japanese Journal of Applied Physics, Part 2: Letters. 2006 ; Vol. 45, No. 46-50.
@article{9d100ddc1a7048d9a80aff39fd5e4828,
title = "Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes",
abstract = "Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.",
keywords = "Chemical mechanical planarization (CMP), High pressure micro jet (HPMJ) pad conditioning, Slurry residues, UV-enhanced fluorescence (UVEF) technique",
author = "Hyosang Lee and Yoshiyuki Seike and Zhonglin Li and Yun Zhuang and Mineo Takaoka and Keiji Miyachi and Ara Philipossian",
year = "2006",
month = "12",
doi = "10.1143/JJAP.45.L1325",
language = "English (US)",
volume = "45",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Japan Society of Applied Physics",
number = "46-50",

}

TY - JOUR

T1 - Characterization of slurry residues in pad grooves for diamond disc and high pressure micro jet pad conditioning processes

AU - Lee, Hyosang

AU - Seike, Yoshiyuki

AU - Li, Zhonglin

AU - Zhuang, Yun

AU - Takaoka, Mineo

AU - Miyachi, Keiji

AU - Philipossian, Ara

PY - 2006/12

Y1 - 2006/12

N2 - Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

AB - Slurry residues inside pad grooves are quantified by UV-enhanced fluorescence (UVEF) technique for conventional diamond disc and high pressure micro jet (HPMJ) pad conditioning methods. Results show that with HPMJ pad conditioning, slurry residues inside pad grooves decrease with time at twice the rate compared to diamond disc conditioning. Therefore, this suggests that HPMJ pad conditioning is a viable method to extend pad life and possibly improve wafer-level defectivity.

KW - Chemical mechanical planarization (CMP)

KW - High pressure micro jet (HPMJ) pad conditioning

KW - Slurry residues

KW - UV-enhanced fluorescence (UVEF) technique

UR - http://www.scopus.com/inward/record.url?scp=33847761949&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847761949&partnerID=8YFLogxK

U2 - 10.1143/JJAP.45.L1325

DO - 10.1143/JJAP.45.L1325

M3 - Article

AN - SCOPUS:33847761949

VL - 45

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 46-50

ER -