Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Yasa Sampurno, Leonard Borucki, Yun Zhuang, Sudhanshu Misra, Karey Holland, Duane Boning, Ara Philipossian

Research output: Contribution to journalArticle

13 Scopus citations

Abstract

This paper systematically studies the effect of pad material, grooving method and grooving pattern on interlayer dielectric chemical mechanical planarization. The tested polishing pads consist of thermoplastic and thermoset polyurethanes synthesized using two different processes. Grooves created using a molding technique are compared with grooves formed by mechanical cutting. The concentric groove design is also compared with the logarithmic positive spiral positive grooving design. Experimental data collected include removal rate, coefficient of friction, shear force variance, pad temperature and dynamic mechanical analyzer measurements. Scanning electron microscope images are used to correlate grooving methods with coefficient of friction and shear force variance measurements. Results show that all of the pads polish wafers in boundary lubrication mode with unique friction coefficient, shear force variance and pad temperature characteristics. Simulations using a two-step removal rate mechanism are performed to estimate the chemical and mechanical rate constants. The analysis indicates that the thermoplastic pad is more mechanically controlled than the thermoset pad and that molded grooving induces a more mechanically controlled process than non-optimized machined grooving.

Original languageEnglish (US)
Pages (from-to)1719-1726
Number of pages8
JournalThin Solid Films
Volume517
Issue number5
DOIs
StatePublished - Jan 1 2009

Keywords

  • CMP
  • Chemical mechanical planarization
  • Friction
  • Groove
  • Pad material
  • Planarization
  • Silicon oxide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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