Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

Yasa Sampurno, Leonard Borucki, Yun Zhuang, Sudhanshu Misra, Karey Holland, Duane Boning, Ara Philipossian

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

This paper systematically studies the effect of pad material, grooving method and grooving pattern on interlayer dielectric chemical mechanical planarization. The tested polishing pads consist of thermoplastic and thermoset polyurethanes synthesized using two different processes. Grooves created using a molding technique are compared with grooves formed by mechanical cutting. The concentric groove design is also compared with the logarithmic positive spiral positive grooving design. Experimental data collected include removal rate, coefficient of friction, shear force variance, pad temperature and dynamic mechanical analyzer measurements. Scanning electron microscope images are used to correlate grooving methods with coefficient of friction and shear force variance measurements. Results show that all of the pads polish wafers in boundary lubrication mode with unique friction coefficient, shear force variance and pad temperature characteristics. Simulations using a two-step removal rate mechanism are performed to estimate the chemical and mechanical rate constants. The analysis indicates that the thermoplastic pad is more mechanically controlled than the thermoset pad and that molded grooving induces a more mechanically controlled process than non-optimized machined grooving.

Original languageEnglish (US)
Pages (from-to)1719-1726
Number of pages8
JournalThin Solid Films
Volume517
Issue number5
DOIs
StatePublished - Jan 1 2009

Fingerprint

grooving
Chemical mechanical polishing
Polyurethanes
Thermosets
Oxides
Thermoplastics
Friction
oxides
Industrial Oils
Bearing pads
grooves
coefficient of friction
Polishing
Molding
Lubrication
shear
Rate constants
Electron microscopes
Scanning
Temperature

Keywords

  • Chemical mechanical planarization
  • CMP
  • Friction
  • Groove
  • Pad material
  • Planarization
  • Silicon oxide

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Metals and Alloys
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications. / Sampurno, Yasa; Borucki, Leonard; Zhuang, Yun; Misra, Sudhanshu; Holland, Karey; Boning, Duane; Philipossian, Ara.

In: Thin Solid Films, Vol. 517, No. 5, 01.01.2009, p. 1719-1726.

Research output: Contribution to journalArticle

Sampurno, Yasa ; Borucki, Leonard ; Zhuang, Yun ; Misra, Sudhanshu ; Holland, Karey ; Boning, Duane ; Philipossian, Ara. / Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications. In: Thin Solid Films. 2009 ; Vol. 517, No. 5. pp. 1719-1726.
@article{72f50525d47442ffa13ef638dcfdba55,
title = "Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications",
abstract = "This paper systematically studies the effect of pad material, grooving method and grooving pattern on interlayer dielectric chemical mechanical planarization. The tested polishing pads consist of thermoplastic and thermoset polyurethanes synthesized using two different processes. Grooves created using a molding technique are compared with grooves formed by mechanical cutting. The concentric groove design is also compared with the logarithmic positive spiral positive grooving design. Experimental data collected include removal rate, coefficient of friction, shear force variance, pad temperature and dynamic mechanical analyzer measurements. Scanning electron microscope images are used to correlate grooving methods with coefficient of friction and shear force variance measurements. Results show that all of the pads polish wafers in boundary lubrication mode with unique friction coefficient, shear force variance and pad temperature characteristics. Simulations using a two-step removal rate mechanism are performed to estimate the chemical and mechanical rate constants. The analysis indicates that the thermoplastic pad is more mechanically controlled than the thermoset pad and that molded grooving induces a more mechanically controlled process than non-optimized machined grooving.",
keywords = "Chemical mechanical planarization, CMP, Friction, Groove, Pad material, Planarization, Silicon oxide",
author = "Yasa Sampurno and Leonard Borucki and Yun Zhuang and Sudhanshu Misra and Karey Holland and Duane Boning and Ara Philipossian",
year = "2009",
month = "1",
day = "1",
doi = "10.1016/j.tsf.2008.09.077",
language = "English (US)",
volume = "517",
pages = "1719--1726",
journal = "Thin Solid Films",
issn = "0040-6090",
publisher = "Elsevier",
number = "5",

}

TY - JOUR

T1 - Characterization of thermoset and thermoplastic polyurethane pads, and molded and non-optimized machined grooving methods for oxide chemical mechanical planarization applications

AU - Sampurno, Yasa

AU - Borucki, Leonard

AU - Zhuang, Yun

AU - Misra, Sudhanshu

AU - Holland, Karey

AU - Boning, Duane

AU - Philipossian, Ara

PY - 2009/1/1

Y1 - 2009/1/1

N2 - This paper systematically studies the effect of pad material, grooving method and grooving pattern on interlayer dielectric chemical mechanical planarization. The tested polishing pads consist of thermoplastic and thermoset polyurethanes synthesized using two different processes. Grooves created using a molding technique are compared with grooves formed by mechanical cutting. The concentric groove design is also compared with the logarithmic positive spiral positive grooving design. Experimental data collected include removal rate, coefficient of friction, shear force variance, pad temperature and dynamic mechanical analyzer measurements. Scanning electron microscope images are used to correlate grooving methods with coefficient of friction and shear force variance measurements. Results show that all of the pads polish wafers in boundary lubrication mode with unique friction coefficient, shear force variance and pad temperature characteristics. Simulations using a two-step removal rate mechanism are performed to estimate the chemical and mechanical rate constants. The analysis indicates that the thermoplastic pad is more mechanically controlled than the thermoset pad and that molded grooving induces a more mechanically controlled process than non-optimized machined grooving.

AB - This paper systematically studies the effect of pad material, grooving method and grooving pattern on interlayer dielectric chemical mechanical planarization. The tested polishing pads consist of thermoplastic and thermoset polyurethanes synthesized using two different processes. Grooves created using a molding technique are compared with grooves formed by mechanical cutting. The concentric groove design is also compared with the logarithmic positive spiral positive grooving design. Experimental data collected include removal rate, coefficient of friction, shear force variance, pad temperature and dynamic mechanical analyzer measurements. Scanning electron microscope images are used to correlate grooving methods with coefficient of friction and shear force variance measurements. Results show that all of the pads polish wafers in boundary lubrication mode with unique friction coefficient, shear force variance and pad temperature characteristics. Simulations using a two-step removal rate mechanism are performed to estimate the chemical and mechanical rate constants. The analysis indicates that the thermoplastic pad is more mechanically controlled than the thermoset pad and that molded grooving induces a more mechanically controlled process than non-optimized machined grooving.

KW - Chemical mechanical planarization

KW - CMP

KW - Friction

KW - Groove

KW - Pad material

KW - Planarization

KW - Silicon oxide

UR - http://www.scopus.com/inward/record.url?scp=56949097736&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=56949097736&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2008.09.077

DO - 10.1016/j.tsf.2008.09.077

M3 - Article

VL - 517

SP - 1719

EP - 1726

JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

IS - 5

ER -