Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP

X. Wei, J. Cheng, A. Meled, Y. Zhuang, L. Borucki, M. Moinpour, D. Hooper, A. Philipossian

Research output: Contribution to conferencePaperpeer-review

Original languageEnglish (US)
Pages322-327
Number of pages6
StatePublished - Dec 1 2008
Event13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008 - Fremont, CA, United States
Duration: Mar 4 2008Mar 6 2008

Other

Other13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008
CountryUnited States
CityFremont, CA
Period3/4/083/6/08

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this