Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP

X. Wei, J. Cheng, A. Meled, Y. Zhuang, L. Borucki, M. Moinpour, D. Hooper, Ara Philipossian

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publication2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008
Pages322-327
Number of pages6
StatePublished - 2008
Event13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008 - Fremont, CA, United States
Duration: Mar 4 2008Mar 6 2008

Other

Other13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008
CountryUnited States
CityFremont, CA
Period3/4/083/6/08

Fingerprint

Diamonds
Wear of materials
Copper
Substrates

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Wei, X., Cheng, J., Meled, A., Zhuang, Y., Borucki, L., Moinpour, M., ... Philipossian, A. (2008). Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP. In 2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008 (pp. 322-327)

Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP. / Wei, X.; Cheng, J.; Meled, A.; Zhuang, Y.; Borucki, L.; Moinpour, M.; Hooper, D.; Philipossian, Ara.

2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008. 2008. p. 322-327.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Wei, X, Cheng, J, Meled, A, Zhuang, Y, Borucki, L, Moinpour, M, Hooper, D & Philipossian, A 2008, Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP. in 2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008. pp. 322-327, 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008, Fremont, CA, United States, 3/4/08.
Wei X, Cheng J, Meled A, Zhuang Y, Borucki L, Moinpour M et al. Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP. In 2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008. 2008. p. 322-327
Wei, X. ; Cheng, J. ; Meled, A. ; Zhuang, Y. ; Borucki, L. ; Moinpour, M. ; Hooper, D. ; Philipossian, Ara. / Characterizing diamond disc substrate loss and diamond micro-wear in copper CMP. 2008 Proceedings - 13th International Chemical-Mechanical Planarization for ULSI Multilevel Interconnection Conference, CMP-MIC 2008. 2008. pp. 322-327
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