Characterizing recycled fumed silica slurries in ILD CMP applications

Ara Philipossian, Farhang Shadman, Patrick Levy, Saied Tousi, Barry Gotlinsk, W. Scott Rader, Paul Lefevre, Isamu Koshiyama

Research output: Contribution to journalReview article

1 Scopus citations

Abstract

Characteristics of recycle fumed silica slurries in interlayer dielectric (ILD) chemical-mechanical polishing (CMP) applications were investigated. All polishing experiments were performed on 100-mm thermally grown SiO2 wafers using a scaled version of a 472 polisher. Recycled slurry decreases the CMP removal rate and reduces the coefficient of friction, effects that are only partially alleviated by slurry filtering. The results show that filtration can reduce defects during CMP processing and is used as means of removing agglomerated particles or foreign materials that may have been introduced into the slurry as a result of ILD polishing.

Original languageEnglish (US)
Pages (from-to)71-82
Number of pages12
JournalMICRO
Volume23
Issue number6
StatePublished - Jul 1 2005

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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  • Cite this

    Philipossian, A., Shadman, F., Levy, P., Tousi, S., Gotlinsk, B., Rader, W. S., Lefevre, P., & Koshiyama, I. (2005). Characterizing recycled fumed silica slurries in ILD CMP applications. MICRO, 23(6), 71-82.