Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity

Arghya Sain, Kathleen L Melde

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents a way to include the effects of conductor surface roughness in three-dimensional full wave simulation tools. A comparison of the computational load and attenuation coefficient as a function of the number and area of different surfaces roughened is given.

Original languageEnglish (US)
Title of host publication2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
Pages260-263
Number of pages4
DOIs
StatePublished - 2012
Event2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 - Tempe, AZ, United States
Duration: Oct 21 2012Oct 24 2012

Other

Other2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012
CountryUnited States
CityTempe, AZ
Period10/21/1210/24/12

Fingerprint

Computational complexity
Surface roughness

Keywords

  • autocorrelation function (ACF)
  • conductor backed coplanar waveguide (CB-CPW)
  • conductor loss
  • interconnect
  • root mean square height (Hrms)
  • surface roughness
  • transmission lines

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sain, A., & Melde, K. L. (2012). Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012 (pp. 260-263). [6457891] https://doi.org/10.1109/EPEPS.2012.6457891

Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity. / Sain, Arghya; Melde, Kathleen L.

2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. p. 260-263 6457891.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sain, A & Melde, KL 2012, Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity. in 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012., 6457891, pp. 260-263, 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012, Tempe, AZ, United States, 10/21/12. https://doi.org/10.1109/EPEPS.2012.6457891
Sain A, Melde KL. Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity. In 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. p. 260-263. 6457891 https://doi.org/10.1109/EPEPS.2012.6457891
Sain, Arghya ; Melde, Kathleen L. / Characterizing the impact of conductor surface roughness on CB-CPW behavior via reduced computational complexity. 2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2012. 2012. pp. 260-263
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