Chemical mechanical planarization and Old Italian violins

Ara Philipossian, Yasa Sampurno, Lauren Peckler

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

Previous studies have shown that spectral analysis based on force data can elucidate fundamental physical phenomena during chemical mechanical planarization (CMP). While it has not been literally described elsewhere, such analysis was partly motivated by modern violinmakers and physicists studying Old Italian violins, who were trying to discover spectral relations to sound quality. In this paper, we draw parallels between violins and CMP as far as functionality and spectral characteristics are concerned. Inspired by the de facto standard of violin testing via hammer strikes on the base edge of a violin's bridge, we introduce for the first time, a mobility plot for the polisher by striking the wafer carrier head of a CMP polisher with a hammer. Results show three independent peaks that can indeed be attributed to the polisher's natural resonance. Extending our study to an actual CMP process, similar to hammered and bowed violin tests, at lower frequencies the hammered and polished mobility peaks are somewhat aligned. At higher frequencies, peak alignment becomes less obvious and the peaks become more isolated and defined in the case of the polished wafer spectrum. Lastly, we introduce another parameter from violin testing known as directivity, Δ, which in our case, we define as the ratio of shear force variance to normal force variance acquired during CMP. Results shows that under identical polishing conditions, D increases with the polishing removal rate.

Original languageEnglish (US)
Article number37
JournalMicromachines
Volume9
Issue number1
DOIs
StatePublished - Jan 18 2018

Fingerprint

Chemical mechanical polishing
Hammers
Polishing
Testing
Spectrum analysis
Acoustic waves

Keywords

  • Chemical mechanical planarization (CMP)
  • Directivity
  • Force cluster plots
  • Guarneri
  • Mobility
  • Spectral analysis of shear forces
  • Spectral analysis of sound
  • Violin

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Mechanical Engineering
  • Electrical and Electronic Engineering

Cite this

Chemical mechanical planarization and Old Italian violins. / Philipossian, Ara; Sampurno, Yasa; Peckler, Lauren.

In: Micromachines, Vol. 9, No. 1, 37, 18.01.2018.

Research output: Contribution to journalArticle

Philipossian, Ara ; Sampurno, Yasa ; Peckler, Lauren. / Chemical mechanical planarization and Old Italian violins. In: Micromachines. 2018 ; Vol. 9, No. 1.
@article{6eecc1454f7d4c88a165a0f318487063,
title = "Chemical mechanical planarization and Old Italian violins",
abstract = "Previous studies have shown that spectral analysis based on force data can elucidate fundamental physical phenomena during chemical mechanical planarization (CMP). While it has not been literally described elsewhere, such analysis was partly motivated by modern violinmakers and physicists studying Old Italian violins, who were trying to discover spectral relations to sound quality. In this paper, we draw parallels between violins and CMP as far as functionality and spectral characteristics are concerned. Inspired by the de facto standard of violin testing via hammer strikes on the base edge of a violin's bridge, we introduce for the first time, a mobility plot for the polisher by striking the wafer carrier head of a CMP polisher with a hammer. Results show three independent peaks that can indeed be attributed to the polisher's natural resonance. Extending our study to an actual CMP process, similar to hammered and bowed violin tests, at lower frequencies the hammered and polished mobility peaks are somewhat aligned. At higher frequencies, peak alignment becomes less obvious and the peaks become more isolated and defined in the case of the polished wafer spectrum. Lastly, we introduce another parameter from violin testing known as directivity, Δ, which in our case, we define as the ratio of shear force variance to normal force variance acquired during CMP. Results shows that under identical polishing conditions, D increases with the polishing removal rate.",
keywords = "Chemical mechanical planarization (CMP), Directivity, Force cluster plots, Guarneri, Mobility, Spectral analysis of shear forces, Spectral analysis of sound, Violin",
author = "Ara Philipossian and Yasa Sampurno and Lauren Peckler",
year = "2018",
month = "1",
day = "18",
doi = "10.3390/mi9010037",
language = "English (US)",
volume = "9",
journal = "Micromachines",
issn = "2072-666X",
publisher = "Multidisciplinary Digital Publishing Institute (MDPI)",
number = "1",

}

TY - JOUR

T1 - Chemical mechanical planarization and Old Italian violins

AU - Philipossian, Ara

AU - Sampurno, Yasa

AU - Peckler, Lauren

PY - 2018/1/18

Y1 - 2018/1/18

N2 - Previous studies have shown that spectral analysis based on force data can elucidate fundamental physical phenomena during chemical mechanical planarization (CMP). While it has not been literally described elsewhere, such analysis was partly motivated by modern violinmakers and physicists studying Old Italian violins, who were trying to discover spectral relations to sound quality. In this paper, we draw parallels between violins and CMP as far as functionality and spectral characteristics are concerned. Inspired by the de facto standard of violin testing via hammer strikes on the base edge of a violin's bridge, we introduce for the first time, a mobility plot for the polisher by striking the wafer carrier head of a CMP polisher with a hammer. Results show three independent peaks that can indeed be attributed to the polisher's natural resonance. Extending our study to an actual CMP process, similar to hammered and bowed violin tests, at lower frequencies the hammered and polished mobility peaks are somewhat aligned. At higher frequencies, peak alignment becomes less obvious and the peaks become more isolated and defined in the case of the polished wafer spectrum. Lastly, we introduce another parameter from violin testing known as directivity, Δ, which in our case, we define as the ratio of shear force variance to normal force variance acquired during CMP. Results shows that under identical polishing conditions, D increases with the polishing removal rate.

AB - Previous studies have shown that spectral analysis based on force data can elucidate fundamental physical phenomena during chemical mechanical planarization (CMP). While it has not been literally described elsewhere, such analysis was partly motivated by modern violinmakers and physicists studying Old Italian violins, who were trying to discover spectral relations to sound quality. In this paper, we draw parallels between violins and CMP as far as functionality and spectral characteristics are concerned. Inspired by the de facto standard of violin testing via hammer strikes on the base edge of a violin's bridge, we introduce for the first time, a mobility plot for the polisher by striking the wafer carrier head of a CMP polisher with a hammer. Results show three independent peaks that can indeed be attributed to the polisher's natural resonance. Extending our study to an actual CMP process, similar to hammered and bowed violin tests, at lower frequencies the hammered and polished mobility peaks are somewhat aligned. At higher frequencies, peak alignment becomes less obvious and the peaks become more isolated and defined in the case of the polished wafer spectrum. Lastly, we introduce another parameter from violin testing known as directivity, Δ, which in our case, we define as the ratio of shear force variance to normal force variance acquired during CMP. Results shows that under identical polishing conditions, D increases with the polishing removal rate.

KW - Chemical mechanical planarization (CMP)

KW - Directivity

KW - Force cluster plots

KW - Guarneri

KW - Mobility

KW - Spectral analysis of shear forces

KW - Spectral analysis of sound

KW - Violin

UR - http://www.scopus.com/inward/record.url?scp=85041068452&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85041068452&partnerID=8YFLogxK

U2 - 10.3390/mi9010037

DO - 10.3390/mi9010037

M3 - Article

AN - SCOPUS:85041068452

VL - 9

JO - Micromachines

JF - Micromachines

SN - 2072-666X

IS - 1

M1 - 37

ER -