Closure to "Discussion of yield function for solder elastoviscoplastic modeling'" (2005, ASME J. Electron. Packag., 127, pp. 147-156)

Research output: Contribution to journalArticle

2 Citations (Scopus)
Original languageEnglish (US)
Article number045502
JournalJournal of Electronic Packaging, Transactions of the ASME
Volume133
Issue number4
DOIs
StatePublished - 2011

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Soldering alloys
Electrons

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Computer Science Applications
  • Mechanics of Materials

Cite this

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title = "Closure to {"}Discussion of yield function for solder elastoviscoplastic modeling'{"} (2005, ASME J. Electron. Packag., 127, pp. 147-156)",
author = "M. Dube and Tribikram Kundu",
year = "2011",
doi = "10.1115/1.4000902",
language = "English (US)",
volume = "133",
journal = "Journal of Electronic Packaging, Transactions of the ASME",
issn = "1043-7398",
publisher = "American Society of Mechanical Engineers(ASME)",
number = "4",

}

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AU - Dube, M.

AU - Kundu, Tribikram

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VL - 133

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JF - Journal of Electronic Packaging, Transactions of the ASME

SN - 1043-7398

IS - 4

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