Closure to "Discussion of yield function for solder elastoviscoplastic modeling'" (2005, ASME J. Electron. Packag., 127, pp. 147-156)

M. Dube, T. Kundu

Research output: Contribution to journalComment/debatepeer-review

2 Scopus citations

Fingerprint Dive into the research topics of 'Closure to "Discussion of yield function for solder elastoviscoplastic modeling'" (2005, ASME J. Electron. Packag., 127, pp. 147-156)'. Together they form a unique fingerprint.