Communication-Tribology of retaining rings in chemical mechanical planarization

Gabriela Diaz, Lauren Peckler, Yasa Sampurno, Ara Philipossian

Research output: Contribution to journalArticle

3 Scopus citations

Abstract

Stribeck and Stribeck+ curves helped determine the tribological mechanisms in the ring-slurry-pad interface. Both methods gave consistent results with the lubrication mechanism starting at “boundary lubrication” and transitioning to “mixed lubrication” as pseudo-Sommerfeld numbers increased. COF for PPS rings were higher than PEEK. They were also higher for inter-level dielectric (ILD) processes as compared to copper. Stribeck curves were used to infer wear rate information about the ring, which in conjunction with Stribeck+ curves could help choose process parameters that balanced wafer removal with ring wear. Data cluster shapes were shown to be due to shear and normal force fluctuations.

Original languageEnglish (US)
Pages (from-to)P266-P268
JournalECS Journal of Solid State Science and Technology
Volume7
Issue number5
DOIs
StatePublished - Jan 2018

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

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