Computer simulation of the temperature cycling tests

Cemal Basaran, Chandrakant S. Desai, Tribikram Kundu, John Prince

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Temperature cycling tests are used to determine the number of cycles to failure of the solder joints in the surface mount technology packages. In this paper the thermomechanical fatigue of Pb40/Sn60 solder joint in a leadless ceramic chip carrier package is studied and Hall [1984] temperature cycling test is simulated by using a finite element procedure with the Disturbed State Concept (DSC) constitutive models. The progress of disturbance (damage) and the energy dissipated in the solder joint during thermal cycling are predicted. It is shown that the disturbance criterion used follows a similar path as the energy dissipation in the system. Moreover, the comparisons between the test data and the finite element analysis show that the number of cycles to failure of a solder joint can be accurately predicted by a finite element procedure using the DSC material models. Furthermore, the analysis give a good picture of the progress of the failure mechanism and the disturbance in the solder joint.

Original languageEnglish (US)
Title of host publicationAmerican Society of Mechanical Engineers, EEP
PublisherASME
Pages77-82
Number of pages6
Volume12
StatePublished - 1995
Externally publishedYes
EventProceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA
Duration: Nov 12 1995Nov 17 1995

Other

OtherProceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition
CitySan Francisco, CA, USA
Period11/12/9511/17/95

Fingerprint

Soldering alloys
Computer simulation
Temperature
Surface mount technology
Thermal cycling
Constitutive models
Energy dissipation
Fatigue of materials
Finite element method

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Basaran, C., Desai, C. S., Kundu, T., & Prince, J. (1995). Computer simulation of the temperature cycling tests. In American Society of Mechanical Engineers, EEP (Vol. 12, pp. 77-82). ASME.

Computer simulation of the temperature cycling tests. / Basaran, Cemal; Desai, Chandrakant S.; Kundu, Tribikram; Prince, John.

American Society of Mechanical Engineers, EEP. Vol. 12 ASME, 1995. p. 77-82.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Basaran, C, Desai, CS, Kundu, T & Prince, J 1995, Computer simulation of the temperature cycling tests. in American Society of Mechanical Engineers, EEP. vol. 12, ASME, pp. 77-82, Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA, USA, 11/12/95.
Basaran C, Desai CS, Kundu T, Prince J. Computer simulation of the temperature cycling tests. In American Society of Mechanical Engineers, EEP. Vol. 12. ASME. 1995. p. 77-82
Basaran, Cemal ; Desai, Chandrakant S. ; Kundu, Tribikram ; Prince, John. / Computer simulation of the temperature cycling tests. American Society of Mechanical Engineers, EEP. Vol. 12 ASME, 1995. pp. 77-82
@inproceedings{cd199289cb624283b73578c0d11c6fa2,
title = "Computer simulation of the temperature cycling tests",
abstract = "Temperature cycling tests are used to determine the number of cycles to failure of the solder joints in the surface mount technology packages. In this paper the thermomechanical fatigue of Pb40/Sn60 solder joint in a leadless ceramic chip carrier package is studied and Hall [1984] temperature cycling test is simulated by using a finite element procedure with the Disturbed State Concept (DSC) constitutive models. The progress of disturbance (damage) and the energy dissipated in the solder joint during thermal cycling are predicted. It is shown that the disturbance criterion used follows a similar path as the energy dissipation in the system. Moreover, the comparisons between the test data and the finite element analysis show that the number of cycles to failure of a solder joint can be accurately predicted by a finite element procedure using the DSC material models. Furthermore, the analysis give a good picture of the progress of the failure mechanism and the disturbance in the solder joint.",
author = "Cemal Basaran and Desai, {Chandrakant S.} and Tribikram Kundu and John Prince",
year = "1995",
language = "English (US)",
volume = "12",
pages = "77--82",
booktitle = "American Society of Mechanical Engineers, EEP",
publisher = "ASME",

}

TY - GEN

T1 - Computer simulation of the temperature cycling tests

AU - Basaran, Cemal

AU - Desai, Chandrakant S.

AU - Kundu, Tribikram

AU - Prince, John

PY - 1995

Y1 - 1995

N2 - Temperature cycling tests are used to determine the number of cycles to failure of the solder joints in the surface mount technology packages. In this paper the thermomechanical fatigue of Pb40/Sn60 solder joint in a leadless ceramic chip carrier package is studied and Hall [1984] temperature cycling test is simulated by using a finite element procedure with the Disturbed State Concept (DSC) constitutive models. The progress of disturbance (damage) and the energy dissipated in the solder joint during thermal cycling are predicted. It is shown that the disturbance criterion used follows a similar path as the energy dissipation in the system. Moreover, the comparisons between the test data and the finite element analysis show that the number of cycles to failure of a solder joint can be accurately predicted by a finite element procedure using the DSC material models. Furthermore, the analysis give a good picture of the progress of the failure mechanism and the disturbance in the solder joint.

AB - Temperature cycling tests are used to determine the number of cycles to failure of the solder joints in the surface mount technology packages. In this paper the thermomechanical fatigue of Pb40/Sn60 solder joint in a leadless ceramic chip carrier package is studied and Hall [1984] temperature cycling test is simulated by using a finite element procedure with the Disturbed State Concept (DSC) constitutive models. The progress of disturbance (damage) and the energy dissipated in the solder joint during thermal cycling are predicted. It is shown that the disturbance criterion used follows a similar path as the energy dissipation in the system. Moreover, the comparisons between the test data and the finite element analysis show that the number of cycles to failure of a solder joint can be accurately predicted by a finite element procedure using the DSC material models. Furthermore, the analysis give a good picture of the progress of the failure mechanism and the disturbance in the solder joint.

UR - http://www.scopus.com/inward/record.url?scp=0029426327&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0029426327&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0029426327

VL - 12

SP - 77

EP - 82

BT - American Society of Mechanical Engineers, EEP

PB - ASME

ER -