Computer simulation of the temperature cycling tests

Cemal Basaran, Chandrakant S. Desai, Tribikram Kundu, John Prince

Research output: Contribution to conferencePaper

Abstract

Temperature cycling tests are used to determine the number of cycles to failure of the solder joints in the surface mount technology packages. In this paper the thermomechanical fatigue of Pb40/Sn60 solder joint in a leadless ceramic chip carrier package is studied and Hall [1984] temperature cycling test is simulated by using a finite element procedure with the Disturbed State Concept (DSC) constitutive models. The progress of disturbance (damage) and the energy dissipated in the solder joint during thermal cycling are predicted. It is shown that the disturbance criterion used follows a similar path as the energy dissipation in the system. Moreover, the comparisons between the test data and the finite element analysis show that the number of cycles to failure of a solder joint can be accurately predicted by a finite element procedure using the DSC material models. Furthermore, the analysis give a good picture of the progress of the failure mechanism and the disturbance in the solder joint.

Original languageEnglish (US)
Pages77-82
Number of pages6
StatePublished - Dec 1 1995
Externally publishedYes
EventProceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition - San Francisco, CA, USA
Duration: Nov 12 1995Nov 17 1995

Other

OtherProceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition
CitySan Francisco, CA, USA
Period11/12/9511/17/95

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

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  • Cite this

    Basaran, C., Desai, C. S., Kundu, T., & Prince, J. (1995). Computer simulation of the temperature cycling tests. 77-82. Paper presented at Proceedings of the 1995 ASME International Mechanical Engineering Congress and Exposition, San Francisco, CA, USA, .