Contactless bottom-up electrodeposition of nickel for 3D integrated circuits

Mingrui Zhao, Rajesh Balachandran, Zach Patterson, Roman Gouk, Steven Verhaverbeke, Farhang Shadman, Manish Keswani

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Fingerprint Dive into the research topics of 'Contactless bottom-up electrodeposition of nickel for 3D integrated circuits'. Together they form a unique fingerprint.

Chemical Compounds

Engineering & Materials Science