Coupled BEM and FEM analysis of functionally graded material layers

M. Das; I. Guven; E. Madenci

doi:10.1080/01495730500360435

Coupled BEM and FEM analysis of functionally graded material layers

M. Das, I. Guven, E. Madenci

Aerospace and Mechanical Engineering

Research output: Contribution to journal › Article › peer-review

6 Scopus citations

Abstract

This study presents the development of a boundary element method (BEM) capable of including functionally graded materials in order to capture the correct behavior of the underfill material in electronic packages. In order to take advantage of the salient features of both FEM and BEM, this study also couples the BEM solution with the conventional FEM solution while satisfying the continuity of displacements and equilibrium of tractions along the interfaces.

Original language	English (US)
Pages (from-to)	263-287
Number of pages	25
Journal	Journal of Thermal Stresses
Volume	29
Issue number	3
DOIs	https://doi.org/10.1080/01495730500360435
State	Published - Mar 1 2006

Keywords

BEM
FEM
Graded
Material

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

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10.1080/01495730500360435

Cite this

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abstract = "This study presents the development of a boundary element method (BEM) capable of including functionally graded materials in order to capture the correct behavior of the underfill material in electronic packages. In order to take advantage of the salient features of both FEM and BEM, this study also couples the BEM solution with the conventional FEM solution while satisfying the continuity of displacements and equilibrium of tractions along the interfaces.",

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AU - Guven, I.

AU - Madenci, E.

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N2 - This study presents the development of a boundary element method (BEM) capable of including functionally graded materials in order to capture the correct behavior of the underfill material in electronic packages. In order to take advantage of the salient features of both FEM and BEM, this study also couples the BEM solution with the conventional FEM solution while satisfying the continuity of displacements and equilibrium of tractions along the interfaces.

AB - This study presents the development of a boundary element method (BEM) capable of including functionally graded materials in order to capture the correct behavior of the underfill material in electronic packages. In order to take advantage of the salient features of both FEM and BEM, this study also couples the BEM solution with the conventional FEM solution while satisfying the continuity of displacements and equilibrium of tractions along the interfaces.

KW - BEM

KW - FEM

KW - Graded

KW - Material

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ER -

Coupled BEM and FEM analysis of functionally graded material layers

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

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