Abstract
This study presents the development of a boundary element method (BEM) capable of including functionally graded materials in order to capture the correct behavior of the underfill material in electronic packages. In order to take advantage of the salient features of both FEM and BEM, this study also couples the BEM solution with the conventional FEM solution while satisfying the continuity of displacements and equilibrium of tractions along the interfaces.
Original language | English (US) |
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Pages (from-to) | 263-287 |
Number of pages | 25 |
Journal | Journal of Thermal Stresses |
Volume | 29 |
Issue number | 3 |
DOIs | |
State | Published - Mar 1 2006 |
Keywords
- BEM
- FEM
- Graded
- Material
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics